MP 30 Wet Process

Wet processing equipment in this class is used to clean, rinse, and otherwise treat wafers or related substrates with liquids and chemical baths. Wet process tools are part of the contamination-control and surface-preparation equipment set in a fab.

Wet process tools move substrates through liquid-based treatment steps rather than dry plasma or vapor steps. The tool class generally uses controlled fluid handling, timed immersion or spray exposure, rinsing, and drying to remove residues and prepare surfaces for later processing.

A wet clean system is typically built around process chambers, tanks, or stations that apply liquids in sequence. The machine class is designed to deliver repeatable cleaning and surface-conditioning steps while limiting particle, ionic, and organic contamination.

The SCREEN MP 30 Wet Process belongs in the wafer cleaning and wet treatment portion of the process flow. The tool class is used before downstream patterning, deposition, or inspection steps that depend on a clean surface.

Wet process equipment commonly sits between fabrication steps that leave residues and later steps that require high surface cleanliness. The class is also used after etch, strip, or mechanical handling steps when the substrate needs liquid-based cleanup.

Wet process tools are used for surface preparation, particulate removal, residue removal, and other cleaning-related steps on semiconductor substrates. The class is relevant wherever liquid chemistries are needed to condition a surface for subsequent processing.