SPTS
Sigma FxP
The SPTS Sigma FxP is a PVD system. The SPTS Sigma FxP has 6-inch wafer size with 8-inch compatibility. The SPTS Sigma FxP is used in advanced packaging applications such as UBM and RDL.[1][2][3]
Wafer size
Mk1 3 KW lamp (provide wafer heating)
Produced
2010–
Power
Power Box (415 VAC, 3 Phase)[4]
Vacuum
Cryo Compressors[4]
What it is
How it works
The Sigma FxP uses vacuum transfer between modules to move wafers through degas, deposition, and etch steps without breaking vacuum.[3][2]
The Sigma FxP configuration includes a vacuum cassette handler, a pre-heat chamber, a tungsten deposition chamber, a titanium and titanium nitride deposition chamber, and a soft sputter etch chamber.[4]
Where it fits in the process flow
Applications
What do the numbers mean?
Power & electrical9
- PSU Power Supplies[4]
- MDX II Advanced Energy 15 KW DC power supply[4]
- Station 3
- W Dep Chamber with tungsten target (W 5N), MDX II Advanced Energy 15 KW DC power supply, slow speed magnetron drive assembly, platen temperature 40°C, onboard CTI 8F cryo pump model 8116065G001, argon delivery through a 300 sccm N2 calibrated MFC, base pressure 7E-8 Torr[4]
- Station 4
- Ti / TiN Dep chamber with titanium target (Ti 4N5), MDX II Advanced Energy 15 KW DC power supply, standard speed magnetron drive assembly, platen temp 40°C, onboard CTI 8F cryo pump model 8116065 G 001, argon delivery through a 300 sccm N2 calibrated MFC, nitrogen delivery through a 300 sccm N2 calibrated MFC, Advanced Energy RFX-600 13.56 MHz RF generator, base pressure <7E-8 Torr[4]
- Station 5
- Soft Sputter Etch Chamber with Advanced Energy RFX-600 13.56 MHz RF generator for platen RF, Aviza LF24 350 KHz RF generator for coil RF, argon delivery through 30 sccm N2 calibrated MFC, onboard CTI 8F cryo pump model 8116065 G 001, Aviza Silicon oil chiller to control wafer temp on the pedestal, base pressure <7-8 Torr[4]
Vacuum & pumping7
Wafer handling4
- Cassette 1[4]
Control & software1
- Control Racks[4]
Configuration & options14
Vintage & configurations
- 2010Production start[2]
Date this product was introduced to the market: 2010.
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- PhasePower Box (415 VAC, 3 Phase)[4]
- ConfigurationPSU Power Supplies[4]
- ConfigurationCryo Compressors[4]
- Station 1Vacuum Cassette Handler (VCH)[4]
- ConfigurationPfeiffer TPH 062 turbo pump & TCP121 controller[4]
- ConfigurationBase pressure <5E-7 Tor[4]
- Wafer sizeMk1 3 KW lamp (provide wafer heating)[1]
- ConfigurationMDX II Advanced Energy 15 KW DC power supply[4]
- Power Box415 VAC, 3 Phase[4]
- Power suppliesPSU Power Supplies[4]
- Vacuum / pumpingCryo Compressors[1]
- Station 2Pre Heat Chamber with Pfeiffer TPH 062 turbo pump and TCP121 controller; base pressure <5E-7 Tor[4]
- Station 3W Dep Chamber with tungsten target (W 5N), MDX II Advanced Energy 15 KW DC power supply, slow speed magnetron drive assembly, platen temperature 40°C, onboard CTI 8F cryo pump model 8116065G001, argon delivery through a 300 sccm N2 calibrated MFC, base pressure 7E-8 Torr[4]
- Station 4Ti / TiN Dep chamber with titanium target (Ti 4N5), MDX II Advanced Energy 15 KW DC power supply, standard speed magnetron drive assembly, platen temp 40°C, onboard CTI 8F cryo pump model 8116065 G 001, argon delivery through a 300 sccm N2 calibrated MFC, nitrogen delivery through a 300 sccm N2 calibrated MFC, Advanced Energy RFX-600 13.56 MHz RF generator, base pressure <7E-8 Torr[4]
- Station 5Soft Sputter Etch Chamber with Advanced Energy RFX-600 13.56 MHz RF generator for platen RF, Aviza LF24 350 KHz RF generator for coil RF, argon delivery through 30 sccm N2 calibrated MFC, onboard CTI 8F cryo pump model 8116065 G 001, Aviza Silicon oil chiller to control wafer temp on the pedestal, base pressure <7-8 Torr[4]
- Station 6Vacuum Cassette Handler (VCH)[4]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Sigma FxP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the Sigma FxP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Sigma FxP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Sigma FxP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Sigma FxP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Sigma FxP are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]3dincites.com — 3dincites.com3dincites.com
- [3]https://www.semiconductorpackagingnews.com/uploads/1/SPTS_Chipmore_Sigma_PR_Final_.pdf — semiconductorpackagingnews.comsemiconductorpackagingnews.com
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]SPTS Sigma fxP Deposition Tool | Used | ClassOne Equipment — classoneequipment.comclassoneequipment.com
Last updated Oct 10, 2026.
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