Sumitomo
SE 130 DU CI Injection
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedInjection molding machines in this class operate by melting or plasticizing a molding compound and injecting it under pressure into a closed mold cavity. For semiconductor packaging, the machine uses a multi-cavity mold with leadframe or substrate strips placed in the mold; then, a measured shot of melted compound is forced into the cavities, encapsulating the die and wire bonds.
Where it fits in the process flow
General reference — not yet source-verifiedUpstream processes include die bond (attach), wire bond, and leadframe/substrate preparation. Downstream processes include post-mold cure, deflash, trim and form, marking, and final test. The machine replaces transfer molding presses or older encapsulation equipment for high-volume packaging of devices like BGA, QFN, SOIC, and memory cards.
What do the numbers mean?
Configuration & options1
- Double Shot[3]
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the SE 130 DU CI Injection are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the SE 130 DU CI Injection are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SE 130 DU CI Injection are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the SE 130 DU CI Injection are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SE 130 DU CI Injection are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SE 130 DU CI Injection is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Equipment inventory listing
Last updated Sep 30, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
