SUSS MicroTec
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The SUSS MicroTec GT200 is an eco-friendly manufacturing solution for wafer cleaning and stripping processes. The SUSS MicroTec GT200 combines photoresist removal, surface activation, and final cleaning in one configurable platform. The SUSS MicroTec GT200 supports up to 200 mm wafers.[1][2]
The GT200 is a wafer cleaning and stripping system for semiconductor manufacturing.
The GT200 combines TurbulenStrip and CrustBuster process technologies on one platform.[4][1][2]
The GT200 uses a hybrid cleaning approach that includes soak-bath stripping with green fluids, single-wafer handling, in-situ UV-based residue breakdown, megasonic DI-water rinse, and spin-rinse-dry functionality.[1][2]
The GT200 is intended for wafer cleaning and stripping operations in semiconductor fabrication.[1]
The GT200 supports up to 200 mm wafers and is specified for silicon, silicon carbide, and other supported wafer materials.[2]
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The GT200 is a wafer cleaning system from SUSS MicroTec, belonging to the GreenTec Solutions line for eco-friendly wet processing.[3]
The GT200 achieves efficient wafer-level cleaning with stable processes, using significantly lower chemical consumption and no hazardous acids or organic solvents.[3]
Yes, it is part of the GreenTec Solutions, which emphasizes lower chemical consumption and elimination of hazardous acids and organic solvents.[3]
The following facts about the GT200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the GT200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the GT200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the GT200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the GT200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the GT200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 9, 2026.
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