SUSS MicroTec

SB 6 GEN 2

Packaging & Bonding SUSS MicroTec SB 6 GEN 2 family

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The SUSS MicroTec SB 6 GEN 2 is a substrate bonder. The SUSS MicroTec SB 6 GEN 2 accommodates standard size, semi spec wafers up to 150 mm in diameter. The SUSS MicroTec SB 6 GEN 2 supports multiple bonding processes.^[1]^[2]

SB 6 GEN 2 — Inventory photo — Fig. 01SB 6 GEN 2Inventory photo^[3]

Power

2000 V, 60 mA^[1]

Vacuum

5 × 10-5 bar^[1]

What it is

The SUSS MicroTec SB 6 GEN 2 is a wafer bonder for packaging and bonding work.^[3]^[1]

The SB 6 GEN 2 is a substrate bonder that handles a range of substrate bonding processes.^[1]

How it works

The SB 6 GEN 2 supports mechanical clamping of substrate stacks with a transport fixture before bonding.^[1]

The SB 6 GEN 2 supports anodic bonding with a dedicated power supply.^[1]

Where it fits in the process flow

The transport fixture can fit into the SUSS MA6 mask aligner, which allows pre-alignment before bonding.^[1]

Applications

The SB 6 GEN 2 is used for MEMS and NEMS devices, 3D photonic devices, device packaging, and thin film material transfer.^[1]

The SB 6 GEN 2 accommodates standard size, semi spec wafers up to 150 mm in diameter, as well as various shapes and types of materials.^[1]

What do the numbers mean?

Power & electrical1

Power supply for anodic bonding: 2000 V, 60 mA^[1]

Vacuum & pumping1

Minimum chamber vacuum: 5 × 10-5 bar^[1]

Wafer handling3

Tool type: Substrate bonder^[1]
Maximum wafer diameter: 150 mm^[1]
Substrate sizes: Pieces to 150 mm^[1]

Configuration & options5

Maximum temperature: 550 °C^[1]
Maximum bonding force: 20 kN^[1]
Maximum thickness: 9.99 mm^[1]
Automation: Semi-automated^[2]
Applications: MEMS, LED, packaging, 2.5D/3D integration^[2]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Minimum chamber vacuum5 × 10-5 bar^[1]
Power supply for anodic bonding2000 V, 60 mA^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What substrate size does the SB 6 GEN 2 support?

The SB 6 GEN 2 supports substrate pieces to 150 mm and accommodates a maximum wafer diameter of 150 mm.^[1]

Does the SB 6 GEN 2 support anodic bonding?

The SB 6 GEN 2 includes a power supply for anodic bonding rated at 2000 V and 60 mA.^[1]

Not publicly documented

The following facts about the SB 6 GEN 2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SB 6 GEN 2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SB 6 GEN 2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SB 6 GEN 2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SB 6 GEN 2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SB 6 GEN 2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report