SUSS MicroTec
SBS 6 Gen 2 Temporary Wafer
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SBS 6 Gen 2 Temporary Wafer is a temporary wafer bonder from SUSS MicroTec. The tool is used for temporary wafer bonding in semiconductor packaging and bonding processes.[1][2]
What it is
How it works
General reference — not yet source-verifiedA temporary wafer bonder holds a wafer to a carrier or handle substrate so the wafer can be processed while mechanically supported.
A temporary bonding tool in this class is used to create and later release a reversible support structure around the wafer during downstream processing.
Where it fits in the process flow
General reference — not yet source-verifiedTemporary wafer bonding sits in the packaging and bonding flow before later processing steps that benefit from added mechanical support.
Temporary bonding is commonly used when a wafer must be thinned, handled, or otherwise processed while attached to a support substrate.
Applications
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the SBS 6 Gen 2 Temporary Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the SBS 6 Gen 2 Temporary Wafer are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SBS 6 Gen 2 Temporary Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SBS 6 Gen 2 Temporary Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SBS 6 Gen 2 Temporary Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SBS 6 Gen 2 Temporary Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]SBS 6 Gen 2 Temporary Wafer — SUSS MicroTec | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 7, 2026.
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