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Tegal

421

Barrel type photoresist asherTegal 421 family
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The Tegal 421 is a barrel-type photoresist asher. The Tegal 421 uses oxygen plasma to strip photoresist. The Tegal 421 is also known as the Plasmaline 421.[1][2][3]

Tegal421
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Power

Up to 200 W[2]

Vacuum

0.500 Torr[2]

Gas delivery

Barrel type photoresist asher[1]

Where it fits in the process flow

The Tegal 421 is dedicated to photoresist stripping and removal of organic films that remain after previous fabrication steps.[4][5][3]

Applications

The primary application of the Tegal 421 is stripping photoresist from semiconductor substrates. The tool can also remove other organic films that are volatilized by an oxygen plasma.[4][5][3]

  • Photoresist stripping

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • High reflected power can cause the RF generator to overheat.
  • The RF power interferes with the temperature gauge; temperature readings require turning off the RF power.
  • Users should not adjust C1 or C2; lab staff should be contacted if adjustment is needed.

What do the numbers mean?

Power & electrical2

RF Power
Up to 200 W[2]
Accurate?
RF forward power
~200 W[2]
Accurate?

Vacuum & pumping4

Chamber Pressure (typical)
0.500 Torr[2]
Accurate?
Base Pressure
< 0.150 Torr[2]
Accurate?
Process pressure
0.500 (± 0.100) Torr[2]
Accurate?
Chamber stabilization pressure
Around 150–200 mT[3]
Accurate?

Gas & chemistry6

Tool type
Barrel type photoresist asher[1]
Accurate?
Process gas
Oxygen (O2)[1]
Accurate?
Use
Stripping of photoresist[1]
Accurate?
Process type
Barrel type photoresist asher[1]
Accurate?
Application
Stripping of photoresist[1]
Accurate?
Process gas flows per operations manual
Oxygen and argon[3]
Accurate?

Configuration & options6

Dry etch classification
Dry etch, reactive ion etching, barrel ashing[1]
Accurate?
Type
Barrel asher[1]
Accurate?
Reactor configuration
Barrel reactor[4]
Accurate?
Etch type
Dry etch, reactive ion etching, barrel ashing[1]
Accurate?
Reflected power limit
< 10 W[2]
Accurate?
Warm-up time
~3–5 minutes[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Tool typeBarrel type photoresist asher[1]
  • Process gasOxygen (O2)[1]
  • UseStripping of photoresist[1]
  • RF PowerUp to 200 W[2]
  • Chamber Pressure (typical)0.500 Torr[2]
  • Base Pressure< 0.150 Torr[2]
  • Process typeBarrel type photoresist asher[1]
  • ApplicationStripping of photoresist[1]
  • Process pressure0.500 (± 0.100) Torr[2]
  • RF forward power~200 W[2]
  • Process gas flows per operations manualOxygen and argon[3]
  • Chamber stabilization pressureAround 150–200 mT[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What gas does the Tegal 421 use for plasma generation?

The tool uses oxygen (O2) as the process gas to create the plasma.[4][5][2][3]

What is the required base pressure before starting a process?

The chamber must be evacuated to a base pressure below 0.150 Torr before oxygen is introduced.[2]

Not publicly documented

The following facts about the 421 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 421 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 421 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 421 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the 421 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 421 are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]cores.research.asu.edu — cores.research.asu.educores.research.asu.edu
  2. [2]nanofabrication.nd.edu — nanofabrication.nd.edunanofabrication.nd.edu
  3. [3]aggiefab.tamu.edu — aggiefab.tamu.eduaggiefab.tamu.edu
  4. [4]cores.research.asu.edu — cores.research.asu.educores.research.asu.edu
  5. [5]Dry etch | NanoFab | Core Facilities | ASU — cores.research.asu.educores.research.asu.edu
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Last updated Sep 30, 2026.