Waferpedia

Thermco

5204 Diffusion

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

5204 Diffusion — Inventory photo
Fig. 015204 DiffusionInventory photo[1]

What it is

General reference — not yet source-verified

The Thermco 5204 Diffusion is a thermal diffusion furnace used in semiconductor manufacturing.

How it works

General reference — not yet source-verified

A diffusion furnace uses a heated process tube to expose wafers to controlled thermal conditions for diffusion and related furnace processes.

Where it fits in the process flow

The Thermco 5204 Diffusion is a furnace used for wafer thermal processing on six inch wafers. The Thermco 5204 Diffusion is part of the diffusion and thermal equipment category.[1][2][3]

Applications

General reference — not yet source-verified

Diffusion furnaces are used for thermal diffusion steps in semiconductor process flows.

What do the numbers mean?

Wafer handling1

Wafer Size
6 inch (150 mm)[1]
Accurate?

Control & software1

Control System
TMX[2]
Accurate?

Configuration & options2

Flat Zone
40 inches[2]
Accurate?
Load Station Length
Approximately 10 feet[2]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What is the typical temperature range for horizontal diffusion furnaces?General reference — not yet source-verified

Diffusion furnaces of this class typically operate from several hundred degrees Celsius up to over a thousand degrees, depending on the specific process (e.g., oxidation, diffusion, annealing). The exact range varies with furnace design and materials, but common temperatures span moderate to high thermal budgets.

How are wafers loaded and unloaded in such a system?General reference — not yet source-verified

Wafers are placed in a quartz boat that is supported by a cantilever or paddle mechanism. The boat is loaded into the furnace tube using a motorized drive that moves it horizontally into the hot zone. The boat remains stationary during the process and is withdrawn after the recipe completes, often with controlled cooling.

What types of process gases are commonly used?General reference — not yet source-verified

Common gases include oxygen (for oxidation), nitrogen or argon (as inert carriers or for annealing), and dopant-containing gases such as phosphine, diborane, or arsine for diffusion. For low-pressure chemical vapor deposition, silane, ammonia, or dichlorosilane may be used, depending on the film to be deposited.

How is temperature uniformity maintained across the wafer load?General reference — not yet source-verified

Multiple thermocouples are placed along the furnace tube to monitor temperature at different zones. The heating elements are zoned and individually controlled, often via a digital controller, to compensate for heat losses at the ends of the tube. A well-designed furnace can achieve uniformity within a very narrow tolerance across the entire boat.

Not publicly documented

The following facts about the 5204 Diffusion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 5204 Diffusion are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 5204 Diffusion are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 5204 Diffusion are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 5204 Diffusion are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 5204 Diffusion is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]5204 Diffusion — Thermco | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Was this page accurate?

Last updated Oct 7, 2026.

Compare with similar tools

View all →