Tokyo Electron
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The Tokyo Electron Clean Track Lithius i+ is a coater and developer system used in semiconductor manufacturing for photolithography processing.[2]
The Clean Track Lithius i+ is designed for the 193 nm immersion lithography process.[1][2]
Coater and developer systems from the Tokyo Electron Clean Track family operate by spin-coating photoresist onto wafers, followed by soft-baking on hot plates to evaporate solvents and promote adhesion.
After wafer exposure in a lithography scanner, the system performs post-exposure bake and develops the latent image by applying developer solution, followed by rinsing and drying.
The system receives wafers from prior process steps such as pre-cleaning or primer deposition and delivers developed wafers for subsequent pattern transfer steps like etching or ion implantation.
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The Clean Track Lithius i+ is a coater and developer semiconductor manufacturing system.[2]
The following facts about the Clean Track Lithius i+ are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Clean Track Lithius i+ are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Clean Track Lithius i+ are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Clean Track Lithius i+ are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Clean Track Lithius i+ are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Clean Track Lithius i+ is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 9, 2026.
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