Waferpedia

Tokyo Electron

Telindy Plus I Rad Vertical

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

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What it is

General reference — not yet source-verified

A vertical thermal/diffusion furnace is a type of semiconductor processing furnace used for high-temperature treatments such as oxidation, diffusion, and annealing. In a vertical configuration, the tube is oriented vertically, allowing wafers to be loaded on a cantilever or paddle and inserted into the hot zone from above or below.

How it works

General reference — not yet source-verified

In a vertical diffusion furnace, the process tube is mounted vertically. Wafers are typically placed in a quartz boat or on a paddle and are loaded into the tube via an elevator mechanism. The furnace has multiple temperature zones to maintain uniform temperature across the load. Gases such as oxygen, nitrogen, or process-specific mixtures are introduced from the top or bottom. The vertical orientation can reduce floor space compared to horizontal tube furnaces and can facilitate easier loading of larger wafers.

Where it fits in the process flow

General reference — not yet source-verified

Thermal furnaces are typically employed after wafer cleaning and before layer deposition. Oxidation furnaces generate silicon dioxide layers that serve as dielectrics or diffusion barriers. Diffusion furnaces are used to modify the electrical properties of the silicon.

Applications

General reference — not yet source-verified

Oxide growth is a fundamental process in semiconductor manufacturing for creating insulating layers in transistors, capacitors, and for mask-making. The furnace can also be used for other thermal processes such as annealing, stress relief, and sintering of thin films.

What do the numbers mean?

Configuration & options1

Oxide[1]
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the make and model of this furnace?

The make is Tel (Tokyo Electron) and the model is Telindy Plus I Rad.[1]

Not publicly documented

The following facts about the Telindy Plus I Rad Vertical are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the Telindy Plus I Rad Vertical are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Telindy Plus I Rad Vertical are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Telindy Plus I Rad Vertical are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Telindy Plus I Rad Vertical are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Telindy Plus I Rad Vertical are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
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Last updated Sep 28, 2026.

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