Ultratech
CGS 300 Stress Measurement
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedStress measurement systems typically use an optical technique to map the topography of the wafer surface. A patterned light beam, often from a laser, is reflected off the wafer and the resulting image is analyzed to determine local curvature. By measuring the wafer curvature before and after a thin film deposition step, the stress induced by the film can be calculated using the Stoney equation.
Where it fits in the process flow
General reference — not yet source-verifiedThe Ultratech CGS 300 Stress Measurement is used in semiconductor fabrication facilities after film deposition, thermal annealing, or etch processes. The tool provides feedback to process engineers to adjust deposition parameters or anneal conditions to maintain target stress levels. Upstream steps include thin-film deposition tools such as chemical vapor deposition or physical vapor deposition systems. Downstream steps include lithography and etch, where excessive wafer bow can cause alignment errors or focus issues.
What do the numbers mean?
Wafer handling1
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of tool is the Ultratech CGS 300 Stress Measurement?
The Ultratech CGS 300 Stress Measurement is a semiconductor wafer stress measurement system.[3]
What wafer size does the CGS 300 Stress Measurement handle?
The CGS 300 Stress Measurement is configured for 12-inch wafers.[3][1]
Where in the process flow is the CGS 300 Stress Measurement used?
The CGS 300 Stress Measurement is used after film deposition, thermal annealing, or etch processes.[3]
What process feedback does the CGS 300 Stress Measurement provide?
The CGS 300 Stress Measurement provides feedback that helps process engineers adjust deposition parameters or anneal conditions to maintain target stress levels.[3]
Not publicly documented
The following facts about the CGS 300 Stress Measurement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CGS 300 Stress Measurement are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CGS 300 Stress Measurement are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CGS 300 Stress Measurement are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CGS 300 Stress Measurement are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CGS 300 Stress Measurement is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]semi-sps.com — semi-sps.comsemi-sps.com
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
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