Veeco
ADS 800 Dicing
Power
220 VAC[1]
Vacuum
200 mm Porous Ceramic Vacuum Chuck[1]
Performance
1.6 Arc Sec Accuracy[1]
Optics
Single Blade Height Detector[1]
What it is
The Veeco ADS 800 Dicing System is configured with motion, control, vision, and coolant delivery components.[2]
How it works
Where it fits in the process flow
The Veeco ADS 800 Dicing System is arranged for workpiece processing up to 8 inch.[3]
Applications
General reference — not yet source-verifiedDicing systems are used for separating patterned semiconductor workpieces and similar substrates into discrete pieces after fabrication.
What do the numbers mean?
Power & electrical6
Vacuum & pumping2
Optics & imaging2
Performance1
- 1.6 Arc Sec Accuracy[1]
Control & software3
- Computer and Front End[1]
Configuration & options13
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ADT 7500 Dicing— Same function class: Dicing & Grinding, UnknownCompare in depthsource[4]
- Disco DAG 810 Automatic— Same function class: Dicing & Grinding, UnknownCompare in depthsource[5]
- Disco DAD 3350 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[6]
- Disco DFD 6340 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[7]
- Disco DFD 6341— Same function class: Dicing & Grinding, nullCompare in depthsource[8]
- Disco DFD 6341 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[9]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the ADS 800 Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ADS 800 Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ADS 800 Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ADS 800 Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ADS 800 Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ADS 800 Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]schmidt.com.tw — schmidt.com.twschmidt.com.tw
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]web.archive.orgweb.archive.org
- [7]Equipment inventory listing
- [8]web.archive.orgweb.archive.org
- [9]Equipment inventory listing
Last updated Oct 4, 2026.
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The Disco DAD 3350 is an automatic dicing saw.
The Disco DAG 810 is an automatic grinder for semiconductor wafer processing, offering a spindle rated at 4.2 kW, torque 5.9 N·m, and speed range 1,000 to 7,000 min⁻¹.
The Disco DFD 6340 is an automatic dicing saw.
The Disco DFD 6341 is a dicer identified with 3-phase, 380-415 V, 3 wire + ground, 50/60 Hz power requirements.
General referenceThe Disco DFD 6341 Automatic Dicing is an automatic dicing saw, a machine used in semiconductor and precision optics manufacturing to singulate individual devices from a substrate.