7200Head

The West Bond 7200Head is a pick and place epoxy die bonder. The 7200Head belongs to the 7200 series of die bonders manufactured by West Bond. Die bonders in this class attach semiconductor die to substrates or packages using epoxy adhesives.^[1]

Pick and place die bonders use a vacuum collet to lift a singulated die from a wafer tape or waffle pack. The collet then transports the die to a bond site where a controlled amount of epoxy has been dispensed. The die is placed onto the epoxy with a programmable force and then the epoxy is cured in a subsequent oven step.

Epoxy die bonders typically include a heated work stage to accelerate epoxy curing or to maintain substrate temperature during bonding. The machine may incorporate vision systems for die alignment and substrate pattern recognition. Some models support multiple bond heads or dual-axis placement for high throughput.

Die bonding follows wafer dicing and precedes wire bonding or encapsulation in a typical semiconductor assembly flow. The die bonder receives singulated die from a wafer-mounting frame and attaches them to leadframes, substrates, or package cavities. After epoxy cure, the assembly moves to wire bonding, which connects the die pads to package leads.

Epoxy die bonding is used for attaching silicon, gallium arsenide, and other semiconductor die to substrates where thermal or electrical conductivity is required. The West Bond 7200Head is suited for general-purpose pick and place assembly in semiconductor packaging, including standard IC packages, multichip modules, and sensor assemblies.