Waferpedia

West Bond

7476E

Packaging & BondingWest Bond 7476E family
Research Quality: 60% complete
7476E — uwaterloo.ca
Fig. 017476Euwaterloo.ca[1]

What it is

General reference — not yet source-verified

The West Bond 7476E is a class of bench-top wire bonding equipment used in microfabrication and packaging for joining fine wire leads to semiconductor devices and related assemblies. Wire bonders occupy the late-stage interconnect step of device buildout, after the underlying structures and bond pads have been formed.

What can it run?

Process applications and technology nodes documented for this tool.

  • Making electrical contacts between semiconductor dies and packages
  • Interconnecting wire leads to semiconductor devices
  • Interconnecting wire leads to hybrid devices
  • Interconnecting wire leads to microwave devices
  • Making electrical interconnects between integrated circuit packages and integrated circuit dies

What do the numbers mean?

Power & electrical2

Purpose
Used for making electrical contacts between semiconductor dies and packages[1]
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Ultrasonic transducer
4 W, 63 kHz[1]
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Control & software2

Manual control
Manual control via 8:1 reduction ratio micromanipulator arm[1]
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Operator interface
Manual control via 8:1 reduction ratio micromanipulator arm[1]
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Configuration & options19

Manufacturer
West Bond[3]
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Model
7476E[3]
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Instrument type
West Bond Wedge-Wedge Gold Wire Bonder[3]
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Description
Two-way convertible wedge-to-wedge ultrasonic bonder[2]
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Bonding technique
Wedge-wedge technique using ultrasonic energy[2]
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Bonding orientations stated
45° wedge bonding; 90° wedge bonding (deep access)[1]
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Compatible wire materials stated
Aluminum or gold wires[2]
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Wire diameter range stated
0.0007 in. to 0.002 in.[2]
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Ribbon diameter range stated
0.001 in. to 0.010 in.[2]
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Default wire
0.001 in. diameter aluminum wire[2]
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Sample holder size
Up to around 30 mm x 30 mm[2]
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Wedge angle configurations
45° and 90° (deep access) wedge bonding[1]
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Wire diameter compatibility
Au or Al wires with 25 μm (0.001") diameter[1]
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Wire size range (thermosonic)
Al and Au wires from 0.7 mil to 2 mil in diameter[1]
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Wire feeding
Wire clamped and threaded diagonally under the bonding wedge, requiring front-to-back bonding direction[2]
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Programmable features
Dual force (high or low), pure vertical Z, pneumatic braking of all axes during bonding, and radiant tool heat[2]
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Standard bonding method
45° wire feed, clamps behind the tool, traditional wedge-wedge[2]
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ESD protection
Electroless nickel plating on exposed tool assemblies and other moving parts; powder-coated paint that is dissipative on exposed painted parts[2]
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Default wire diameter
0.001 in. diameter wire[2]
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What replaced it?

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • PurposeUsed for making electrical contacts between semiconductor dies and packages[1]
  • Ultrasonic transducer4 W, 63 kHz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What bonding styles does the West Bond 7476E support?

The West Bond 7476E supports standard forty-five-degree wedge bonding and ninety-degree deep-access wedge bonding.[1]

What wire materials are used with the West Bond 7476E?

The West Bond 7476E is used with aluminum wire and gold wire.[2][1]

What kinds of devices does the West Bond 7476E interconnect?

The West Bond 7476E interconnects semiconductor, hybrid, and microwave devices, and it is used for electrical contacts between semiconductor dies and packages.[2][1]

Is the West Bond 7476E a manual or automated tool?

The West Bond 7476E is a manual wirebonding tool.[1]

Not publicly documented

The following facts about the 7476E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7476E are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 7476E are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 7476E are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 7476E are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 7476E is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]uwaterloo.ca — uwaterloo.cauwaterloo.ca
  2. [2]snsf.stanford.edu — snsf.stanford.edusnsf.stanford.edu
  3. [3]ncf.uic.edu — ncf.uic.eduncf.uic.edu
  4. [4]manualslib.commanualslib.com
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Last updated Oct 4, 2026.

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