West Bond
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The West Bond 7600C is a deep access 90° feed wedge wire bonder.[1]
The West Bond 7600C is a deep access 90° feed wedge wire bonder.[1]
The West Bond 7600C uses a 90° feed arrangement and is configured for deep access bonding.[1]
The West Bond 7600C is used where bond access is constrained and the bonding tool must reach into deeper package geometries.[1]
The West Bond 7600C is a wire bonding machine for semiconductor packaging and assembly.[1]
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The West Bond 7600C uses a deep access 90° feed wedge wire bonder configuration.[1]
The West Bond 7600C is a wedge wire bonder.[1]
The West Bond 7600C is used in semiconductor packaging and bonding.[1]
The following facts about the 7600C are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7600C are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7600C are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7600C are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7600C are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7600C is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 3, 2026.
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