Wyko
Wyko SP3000 Interconnect Profiling System is an automated optical profiler. Wyko SP3000 Interconnect Profiling System provides non-contact 3D measurement of large format samples. Wyko SP3000 Interconnect Profiling System includes Wyko Vision32 analysis software.[1]

The Wyko SP3000 is an automated optical profiler designed for non-contact three-dimensional measurement of large-format samples.[1]
The SP3000 employs Wyko Vision32 analysis software, which provides specialized algorithms, an automation scripting language, and an integrated database for automatic data logging and real-time go/no-go feedback. A master database enables trending analysis over a product's lifecycle.[1]
Because the system is gauge-capable, it can be integrated directly into a production line for real-time monitoring, providing automatic pass/fail decisions for each substrate.[1]
The SP3000 is used in flip-chip packaging to control critical dimensions and assess the electrical and mechanical reliability of advanced packaging substrates.[1]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| SP3200 Advanced Packaging Profiling System | — | — | Described as an advanced packaging profiling system and, compared with the SP3000, presented as a dual-process-control profiler that functions as both a surface metrology tool and a defect inspection tool. | web.archive.org[2] |
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Important specifications include vertical resolution, lateral resolution, field of view, measurement repeatability, and throughput. The system's ability to handle high aspect ratio features and varying surface reflectivity also matters for interconnect metrology.
The following facts about the SP3000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SP3000 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the SP3000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SP3000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SP3000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SP3000 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 5, 2026.