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Wyko

SP3000

Wyko SP3000 Interconnect Profiling System is an automated optical profiler. Wyko SP3000 Interconnect Profiling System provides non-contact 3D measurement of large format samples. Wyko SP3000 Interconnect Profiling System includes Wyko Vision32 analysis software.[1]

SP3000 — web.archive.org
Fig. 01SP3000web.archive.org[1]

What it is

The Wyko SP3000 is an automated optical profiler designed for non-contact three-dimensional measurement of large-format samples.[1]

How it works

The SP3000 employs Wyko Vision32 analysis software, which provides specialized algorithms, an automation scripting language, and an integrated database for automatic data logging and real-time go/no-go feedback. A master database enables trending analysis over a product's lifecycle.[1]

Where it fits in the process flow

Because the system is gauge-capable, it can be integrated directly into a production line for real-time monitoring, providing automatic pass/fail decisions for each substrate.[1]

Applications

The SP3000 is used in flip-chip packaging to control critical dimensions and assess the electrical and mechanical reliability of advanced packaging substrates.[1]

  • Interconnect profiling
  • In-line process monitoring of flip-chip packaging
  • Controlling critical dimensions
  • Determining electrical/mechanical reliability of advanced packaging substrates

What do the numbers mean?

Optics & imaging1

Type
Automated optical profiler[1]
Accurate?

Control & software4

Software included
Wyko Vision32 analysis software[1]
Accurate?
Software functions
Specialized algorithms, automation scripting language, integrated database, automatic data logging, real-time go/no-go feedback[1]
Accurate?
Software
Wyko Vision32 analysis software[1]
Accurate?
Software features
Specialized algorithms, automation scripting language, integrated database, automatic data logging, real-time go/no-go feedback[1]
Accurate?

Configuration & options7

Measurement type
Non-contact 3D measurement[1]
Accurate?
Sample type
Large format samples[1]
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Process focus
In-line process monitoring of flip-chip packaging[1]
Accurate?
Capability
Gauge-capable[1]
Accurate?
Analysis function
Trending analysis over a product's lifecycle[1]
Accurate?
Measurement
Non-contact 3D measurement of large format samples[1]
Accurate?
Application
In-line process monitoring of flip-chip packaging[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
SP3200 Advanced Packaging Profiling System——Described as an advanced packaging profiling system and, compared with the SP3000, presented as a dual-process-control profiler that functions as both a surface metrology tool and a defect inspection tool.web.archive.org[2]
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What replaced it?

  • siblingWyko SP3200— Listed alongside the SP3200 in the product lineup.source[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What are the key specifications to consider when evaluating an interconnect profiling system?General reference — not yet source-verified

Important specifications include vertical resolution, lateral resolution, field of view, measurement repeatability, and throughput. The system's ability to handle high aspect ratio features and varying surface reflectivity also matters for interconnect metrology.

Not publicly documented

The following facts about the SP3000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SP3000 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the SP3000 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the SP3000 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the SP3000 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the SP3000 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]Veeco Products - Show All Products — web.archive.orgweb.archive.org
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Last updated Oct 5, 2026.