YES
CV200RF
The YES CV200RF is a plasma stripping system that removes thick layers of photoresist and polyimide in the shortest amount of production time. The YES CV200RF uses an automated, user-friendly system with a selectable descum function for gentler cleaning operations. The YES CV200RF replaces hazardous and messy wet chemical processes with plasma cleaning technology.[1]
What it is
The YES CV200RF is a plasma strip and descum system for removing photoresist and related organic residues from substrates.[1][2]
How it works
Applications
The CV200RF is used for photoresist removal, polyimide removal, organics removal, etching, surface preparation, CD master cleaning, and descumming.[1][2]
- Photoresist removal
- Polyimide removal
- Organics removal
- Etching
- Surface preparation
- CD master cleaning
- Descumming
What do the numbers mean?
Wafer handling1
Gas & chemistry1
Configuration & options3
Vintage & configurations
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Primary materials removedPhotoresist and polyimide[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the difference between a strip process and a descum process?General reference — not yet source-verified
Strip processes are intended to remove a bulk photoresist layer, while descum processes use a short, gentler plasma exposure to remove thin organic residue from patterned openings or surfaces. Both are performed in the same type of plasma processing system, with process conditions adjusted to control removal rate and selectivity.
Why is a plasma strip/descum system needed after etching or implantation?General reference — not yet source-verified
After these steps, the masking photoresist and byproducts such as polymers or metal oxides remain on the wafer. If left in place, they can interfere with subsequent deposition, adhesion, or contacting steps. A plasma strip/descum system removes this material without creating significant wafer damage.
What kinds of process gases are commonly used in this class of machine?General reference — not yet source-verified
Oxygen-based chemistries are typical because oxygen radicals react readily with organic materials. Mixtures may include other gases to adjust strip rate, selectivity, or residue solubility; fluorine-containing additives are sometimes used for difficult residues. The exact gas set depends on the application and the materials on the wafer.
How does process control ensure uniform stripping across the wafer?General reference — not yet source-verified
Uniformity is managed through chamber pressure, gas flow distribution, plasma power distribution, and wafer temperature control. Process monitoring may include endpoint detection, optical emission, or pressure-based signals to determine when the material has been removed. Repeatable recipes and hardware design keep the strip/descum result consistent across the wafer surface and from wafer to wafer.
Not publicly documented
The following facts about the CV200RF are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CV200RF are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the CV200RF are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CV200RF are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CV200RF is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the CV200RF are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.