Comparison ledger
Accretech UF 300 A Automatic Wafer, Tokyo Electron Precio Octo, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 300 A Automatic WaferAccretech | Precio OctoTokyo Electron |
|---|---|---|
| OEM | Accretech | Tokyo Electron |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2001 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 300 | Tokyo Electron Precio |
| Cited variants | — | |
| Specifications | ||
| Configuration | Nickel chuck[5] | 50/60 Hz[7] |
| Phase | 1 Phase[5] | — |
| Cognex board type | 8200[6] | — |
| Voltage | 208V[6] | — |
| OEM | Accretech / TSK[5] | — |
| Model | UF 300 A[5] | — |
| Equipment type | Automatic Wafer Prober[5] | — |
| Wafer size | 8 inch[5] | — |
| Chuck | Nickel chuck[5] | — |
| Power | 1 Phase[5] | — |
| Vintage | 2001[5] | — |
| Keyboard/joystick | Keyboard, joystick[6] | — |
| Storage | 3.5" floppy disk / 3.5" hard disk[6] | — |
| Printer | Internal printer[6] | — |
| Interfaces | GPIB I/F, RS232 I/F, Ethernet I/[6] | — |
| Functions | Probe mark inspection; automatic probe to pad alignment; multi-die probing up to 256 DUTs; multi function cleaning pad; automatic needle height alignment; soak time option; new E2 camera update[6] | — |
| Chuck Type | Nickel chuck (some units) or gold plated chuck (other units)[6] | Gold hot & cold chuck top system[4] |
| Automation | Fully automatic[6] | — |
| Probe Card Change | Included[6] | — |
| User Interface | Keyboard, joystick, 3.5" floppy disk / hard disk, internal printer[6] | — |
| Vision System | Cognex board type 8200, New E2 camera update[6] | — |
| Probing Features | Multi-die probing up to 256 DUTs, automatic probe to pad alignment, probe mark inspection, automatic needle height alignment[6] | — |
| Cleaning | Multi function cleaning pad[6] | — |
| Soak Option | Soak time option[6] | — |
| CPU | — | VIP3A[4] |
| Chiller | — | C255 (-55 ~ 200 degrees C)[4] |
| Wafer Size | — | 4", 5", 8"[7] |
| Chiller Model | — | C255[4] |
| Temperature Range | — | -55 to 200 degrees C[4] |
| Interface | — | GPIB[4] |
| Loader Type | — | Right side single top loader[4] |
| Vintage (unit) | — | 2022[7] |
| Probe Mark Inspection | — | Supports TELPADS-O high-speed PMI[1] |
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