Accretech
UF 300 A Automatic Wafer
The Accretech / TSK UF 300 A is an automatic wafer prober for 8-inch wafers. The UF 300 A is configured as a fully automatic system with a gold plated or nickel chuck. The prober supports multi-die probing up to 256 DUTs and includes probe mark inspection and automatic alignment capabilities.[1][2][3]
Plate 01UF300A 300mm TSK/ACCRETECH Wafer Prober
Gustavo OrtegaWatch on YouTubePlate 02UF300A 300mm TSK/ACCRETECH Wafer Prober
Gustavo OrtegaWatch on YouTubePlate 03UF300 TSK/ACCRETECH Wafer Prober
Gustavo OrtegaWatch on YouTube
What it is
General reference — not yet source-verifiedAutomatic wafer probers are used to contact every die on a wafer with precision probe needles so that electrical measurements can be made before the wafer is diced into individual chips.
How it works
The machine includes automatic probe-to-pad alignment, automatic needle height alignment, and probe mark inspection capabilities.[2]
The system supports simultaneous probing of up to 256 devices under test (DUTs) using multi-die probing.[2]
A Cognex 8200 board is employed for vision-based alignment and inspection tasks.[2]
Where it fits in the process flow
General reference — not yet source-verifiedWafer probing is a test step performed after all front-end-of-line wafer fabrication processes are complete, before dicing and packaging.
The probed wafer is then sent to dicing saws which separate the individual die, followed by packaging and final test.
Applications
General reference — not yet source-verifiedAutomatic wafer probers are used for parametric testing, functional testing, and reliability assessment of semiconductor devices at the wafer level.
What do the numbers mean?
Power & electrical4
- Single Phase[2]
Wafer handling7
Optics & imaging3
Performance3
Control & software3
Configuration & options25
- Fully Automatic[2]
- Probe Card Change[2]
- Keyboard, joystick[2]
- 3.5" floppy disk / 3.5" hard disk[2]
- Internal printer[2]
- GPIB I/F[2]
- RS232 I/F[2]
- Ethernet I/[2]
- Probe mark inspection[2]
- Multi-die probing up to 256 DUTs[2]
- Multi function cleaning pad[2]
- Soak time option[2]
Vintage & configurations
- 2001Vintage[1]
Source describes the unit as 2001 vintage.
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Electroglas EG 4090 u+— Same function class: Test & Probe, UnknownCompare in depthsource[4]
- Tokyo Electron Precio Automatic Wafer— Same function class: Test & Probe, UnknownCompare in depthsource[5]
- Tokyo Electron Precio XL— Same function class: Test & Probe, UnknownCompare in depthsource[6]
- Semics Opus 3— Same function class: Test & Probe, UnknownCompare in depthsource[7]
- Eagle ETS 200 T— Same function class: Test & Probe, UnknownCompare in depthsource[8]
- Tokyo Electron Precio Octo— Same function class: Test & Probe, nullCompare in depthsource[9]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the UF 300 A Automatic Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the UF 300 A Automatic Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 300 A Automatic Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 300 A Automatic Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 300 A Automatic Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the UF 300 A Automatic Wafer are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]Equipment inventory listing
- [7]Equipment inventory listing
- [8]Equipment inventory listing
- [9]web.archive.orgweb.archive.org
Last updated Oct 3, 2026.
Compare with similar tools
View all →
The Electroglas EG 4090 u+ is a prober for 8-inch wafers.
The Eagle ETS 200 T is a semiconductor test system for discrete device testing and wafer sort to final test applications.
The Semics Opus 3 is a prober for semiconductor wafers, supporting 8 and 12 inch wafer sizes.
Tokyo Electron Precio Octo is a prober with source-stated wafer sizes ranging from 4 inch to 8 inch.
