ADT
7500 Dicing alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Veeco
ADS 800 Dicing
Dicing & Grinding
The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
Disco
DAD 3220 Automatic Dicing
Dicing & Grinding
The Disco DAD 3220 is an automatic dicing saw with source-stated configurations including a 1.5 kW spindle, a 1000 watt spindle, and a 40,000 min spindle revolutions specification.
Disco
DAD 3221 Automatic Dicing
Dicing & Grinding
The Disco DAD 3221 Automatic Dicing Saw is a single-spindle dicing saw for wafers up to 6 inches, with a 6-inch porous chuck table and an automatic pattern-recognition and alignment system.
Disco
DFD 6341 Automatic Dicing
Dicing & Grinding
The Disco DFD 6341 Automatic Dicing is an automatic dicing saw, a machine used in semiconductor and precision optics manufacturing to singulate individual devices from a substrate.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
Compare interactively
Need a side-by-side spec table? Open the compare tool to pick any two models.
Compare 7500 Dicing with another model →