Comparison ledger
Applied Materials 0010-03254 E Chuck, Assembleon Topaz X II Placement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03254 E ChuckApplied Materials | Topaz X II PlacementAssembleon |
|---|---|---|
| OEM | Applied Materials | Assembleon |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Assembleon Topaz X II Placement |
| Cited variants | — | |
| Specifications | ||
| Phase | — | 3 Phase[2] |
| Frequency | — | 60 Hz[2] |
| Placement Speed (optimal) | — | 20,000 CPH[3] |
| Placement Speed (IPC 9850) | — | 15,400 CPH[3] |
| Placement Accuracy (3σ, chips) | — | ±50 µm[3] |
| Placement Accuracy (3σ, QFP 0.4mm pitch) | — | ±35 µm[3] |
| Maximum Board Size (L x W) | — | 460 x 440 mm[3] |
| Minimum Board Size (L x W) | — | 50 x 50 mm[3] |
| Large Board Application | — | 650 x 850 mm[3] |
| Board Thickness | — | 0.4 to 4.0 mm[3] |
| Component Range | — | 01005 (0402) to 45 x 100 mm (BGA, µBGA, CSP, Connector, Odds)[3] |
| Maximum Component Height | — | 11 mm (with area CCD camera)[3] |
| Head Design (SF) | — | One single beam with 8 super fine heads[3] |
| Head Design (FNC) | — | One single beam carrying 4 standard heads and 4 heads with nozzle exchange on-the-fly[3] |
| Footprint (L x W) | — | 1650 x 1408 mm[3] |
| Operating System | — | Windows NT[3] |
| Tape Feeding Positions (8mm) | — | 90 (CLi) or 160 (ITF)[3] |
| Tray Feeding | — | LCS tray feeder with 40 pallets, single ATS tray feeder with 20 pallets[3] |
| Feeder Trolleys | — | 4 x 20 position (CLi) or 4 x 20 position (ITF)[3] |
| Alignment Principle | — | Line array camera, area CCD camera, co-planarity check on-the-fly[3] |