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Assembleon

Topaz X II Placement

Assembleon Topaz X II Placement family
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Topaz X II Placement — Inventory photo
Fig. 01Topaz X II PlacementInventory photo[1]

Power

3 Phase[1]

Performance

±50 µm[2]

Optics

11 mm (with area CCD camera)[2]

What it is

The Assembleon Topaz X II is a pick-and-place machine for surface-mount technology (SMT) assembly. The machine is manufactured by Assembleon, a brand that was part of Philips and later Kulicke & Soffa.[1][2][4]

How it works

The Topaz X II uses a single beam gantry system. Two head configurations are available: a Super Fine (SF) head with eight placement heads, and a Flying Nozzle Change (FNC) head combination carrying four standard heads and four heads with nozzle exchange on-the-fly. Components are picked from tape, tray, stick, or waffle-pack feeders and placed onto PCBs transported by a conveyor.[2][4]

Alignment is performed by a line array camera for on-the-fly vision using the VICS processing system, and an area CCD camera for larger components. Fiducial alignment uses a moving CCD camera. The machine operates under Windows NT.[2][4]

What do the numbers mean?

Power & electrical2

Phase
3 Phase[1]
Accurate?
Frequency
60 Hz[1]
Accurate?

Optics & imaging2

Maximum Component Height
11 mm (with area CCD camera)[2]
Accurate?
Alignment Principle
Line array camera, area CCD camera, co-planarity check on-the-fly[2]
Accurate?

Performance2

Placement Accuracy (3σ, chips)
±50 µm[2]
Accurate?
Placement Accuracy (3σ, QFP 0.4mm pitch)
±35 µm[2]
Accurate?

Control & software1

Operating System
Windows NT[2]
Accurate?

Dimensions & facilities1

Footprint (L x W)
1650 x 1408 mm[2]
Accurate?

Configuration & options12

Placement Speed (optimal)
20,000 CPH[2]
Accurate?
Placement Speed (IPC 9850)
15,400 CPH[2]
Accurate?
Maximum Board Size (L x W)
460 x 440 mm[2]
Accurate?
Minimum Board Size (L x W)
50 x 50 mm[2]
Accurate?
Large Board Application
650 x 850 mm[2]
Accurate?
Board Thickness
0.4 to 4.0 mm[2]
Accurate?
Component Range
01005 (0402) to 45 x 100 mm (BGA, µBGA, CSP, Connector, Odds)[2]
Accurate?
Head Design (SF)
One single beam with 8 super fine heads[2]
Accurate?
Head Design (FNC)
One single beam carrying 4 standard heads and 4 heads with nozzle exchange on-the-fly[2]
Accurate?
Tape Feeding Positions (8mm)
90 (CLi) or 160 (ITF)[2]
Accurate?
Tray Feeding
LCS tray feeder with 40 pallets, single ATS tray feeder with 20 pallets[2]
Accurate?
Feeder Trolleys
4 x 20 position (CLi) or 4 x 20 position (ITF)[2]
Accurate?

Observed configurations

How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.

Unit as listed[1]

  • comes with over 150 feeders
  • comes with 3 carts
  • 3 Phase

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
Topaz-XII with FNC head (PA 1314/01)——Equipped with fine-pitch nozzle change head (FNC) - one single beam with 4 standard heads and 4 heads with nozzle exchange on-the-flyscribd.com[3]
Topaz-XII with SF head (PA 1314/02)——Equipped with super fine head (SF) - one single beam with 8 super fine headsscribd.com[3]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Phase3 Phase[1]
  • Frequency60 Hz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the placement speed of the Topaz X II?

The optimal placement speed is 20,000 CPH (components per hour). The IPC 9850 standard output is 15,400 CPH.[2]

What is the mounting accuracy?

Placement accuracy is ±50 microns at CpK 1 for chips and SOIC, ±40 microns for QFPs with 0.5 mm pitch, and ±35 microns for QFPs with 0.4 mm pitch. Angular accuracy for fine-pitch QFPs is ±0.09°.[2][4]

What is the maximum PCB size it can handle?

The maximum board size is 460 x 440 mm. A large-board option supports 650 x 850 mm. Minimum board size is 50 x 50 mm.[2]

What head configurations are available?

Two head options exist: one single beam with 8 super fine (SF) heads, or one single beam carrying 4 standard heads and 4 heads with nozzle exchange on-the-fly (FNC).[2]

What alignment systems does it use?

A line array camera with fore and side illumination for on-the-fly vision, an area CCD camera for large components, and a moving CCD camera for fiducial alignment.[4][2]

Not publicly documented

The following facts about the Topaz X II Placement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Topaz X II Placement are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Topaz X II Placement are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Topaz X II Placement are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Topaz X II Placement is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Topaz X II Placement are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]efsmt.com — efsmt.comefsmt.com
  3. [3]scribd.com — scribd.comscribd.com
  4. [4]Assembleon topaz xii — smtnet.comsmtnet.com
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Last updated Sep 24, 2026.

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