Comparison ledger
Applied Materials 0010-03485 Magnet Assy, Nitto MSA 840 Wafer Mounter, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Nitto |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | Nitto MSA 840 Wafer Mounter |
| Cited variants | — |
|
| Specifications | ||
| Configuration | WP AL 300mm PVD[2] | — |
| OEM | Applied Materials[2] | — |
| Model | 0010-03485[2] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[3] | — |
| Process | PVD[4] | — |
| Wafer size | 300mm[5] | — |
| Version | Spares[5] | — |
| Part Number | 0010-03485[2] | — |
| Manufacturer | Applied Materials[2] | — |
| Process Type | PVD (Physical Vapor Deposition)[2] | — |
| Application (Material) | Aluminum (AL)[2] | — |
| Wafer Diameter (associated) | 300 mm[2] | — |
| Applicable wafer size | — | 4", 5", 6", 8"[1] |
| Applicable frame size | — | for 6", for 8"[1] |
| Throughput (approx.) | — | 30 sec/wafer (excluding wafer and frame setting time and wafer mount frame removing time)[1] |
| Dimensions (W x D x H) | — | 800 x 670 x 750 mm[1] |
| Weight | — | approx. 135 kgf[1] |
| Power supply | — | Single-Phase AC100V[6] |
| Air pressure | — | 0.3-0.5 MPa[6] |
| Applicable wafer thickness (Contact Table) | — | 200 µm or more[6] |
| Applicable wafer thickness (Non-Contact Table) | — | 250 µm or more[6] |
| Static eliminator | — | 1 Fan type & 2 brush type[1] |
| Taping speed control | — | Variable by manual setting[1] |
| Taping tension | — | H/L auto changing with tape Dia. H/L Variable by manual setting[1] |
| Cut number counter | — | Equipped[1] |
| Cutting dia. detection | — | Available[1] |
| Cutting miss detection | — | Available[1] |
| Optional function | — | Magnetic holder can be added in case of using high adhesive tape[1] |
| No wafer operation | — | Tape applying on dicing frame without wafer[1] |
| Touch Panel | — | 3.8 inch[1] |
| Work holding system | — | By vacuuming[1] |
| Wafer table | — | Non contact table available[1] |
| Type | — | Semi automatic type to set wafer and frame manually and to do tape applying, cutting and removing waste tape automatically[1] |