Nitto
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The Nitto MSA 840 is a semi-automatic wafer mounter designed for dicing processes. The Nitto MSA 840 handles wafers from 4 to 8 inches using a non-contact chuck method. The operator manually places the wafer and frame, and the system automatically feeds, applies, cuts, and removes the tape.[1]
The Nitto MSA 840 is a semi-automatic wafer mounter designed for the dicing process in semiconductor packaging. The machine is manufactured by Nitto Denko. The MSA 840 is a semi-automatic type that requires the operator to manually place the wafer and frame, after which tape applying, cutting, and waste tape removal are performed automatically. The MSA 840 can be converted to full automatic operation with the addition of a wafer and frame handling tool.[1][3]
Wafer mounters apply a dicing tape to the back side of a wafer and mount the wafer on a dicing frame. The MSA 840 performs the tape applying, cutting, and waste tape removal operations automatically. The machine uses a non-contact chuck method that contacts three to four millimeters of the wafer edge, though a contact chuck method is also applicable. The system includes one fan type and two brush type ionizers for static elimination. Taping speed control is variable by manual setting, and taping tension can be set to high/low auto changing with tape diameter or variable by manual setting. The machine is equipped with a cutting diameter detection sensor and a cutting miss detection function.[1]
The MSA 840 features a 3.8 inch touch panel for user interface. The primary work holding system uses vacuuming. The wafer table is of a non-contact type. A tape remaining detecting sensor is equipped, and a cut number counter is included. The machine provides a 'No wafer operation' mode, which allows tape applying on a dicing frame without a wafer. The number of cuts and taping tension parameters can be set through the touch panel and embedded in a recipe.[1]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MSA840-II | — | — | Brochure designates NEL-MSA840-II; no explicit differences from base MSA840 documented. | semicorp.com[1] |
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The throughput is approximately thirty seconds per wafer, excluding wafer and frame setting time and wafer mount frame removing time.[1]
The applicable wafer thickness is two hundred micrometers or more for the contact table, and two hundred fifty micrometers or more for the non-contact table.[2]
The system automatically feeds the tape, applies it to the frame and wafer, trims the tape, and removes the waste tape.[3]
The following facts about the MSA 840 Wafer Mounter are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MSA 840 Wafer Mounter are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MSA 840 Wafer Mounter are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MSA 840 Wafer Mounter are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MSA 840 Wafer Mounter is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MSA 840 Wafer Mounter are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Sep 27, 2026.
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