Comparison ledger
Applied Materials 9500 XR, Varian 160 XP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 9500 XRApplied Materials | 160 XPVarian |
|---|---|---|
| OEM | Applied Materials | Varian |
| Category | Ion Implantation | Ion Implantation |
| Wafer size | Wafer on Gripper Sensor | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials PI 9500 | Varian 160 XP |
| Cited variants | — |
|
| Specifications | ||
| Voltage | 208 V[2] | — |
| Phase | 3 phase + Neurtal[2] | — |
| Configuration | 50/60 Hz[2] | — |
| Circuit Breaker | 250 A[2] | — |
| Interrupt Capacity | 65000 A[2] | — |
| CPU | 162 031[2] | — |
| Software | 4.09[2] | — |
| Chamber | CT 10 Cryos[2] | — |
| Source Turbo | STP 1000 C[2] | — |
| Mrs Turbo | STP 400[2] | — |
| Source Backing | QDP 40[2] | — |
| Wafer Loader | QDP 80[2] | — |
| Wafer size | Wafer on Gripper Sensor[2] | — |
| Wheel | Direct Drive[2] | — |
| Tilt | 0 to 7[2] | — |
| BF3 | SDS[2] | — |
| Manufacturer | Applied Materials[2] | — |
| Model | 9500 XR[2] | — |
| Category | Ion Implantation[3] | — |
| Wafer size / configuration | Wafer on Gripper Sensor[3] | — |
| Frequency | 50/60 Hz[2] | — |
| Orient | Flat Not Found Sensor[2] | — |
| Gripper | Wafer on Gripper Sensor[2] | — |
| Gas Box | BF3, PH3, AsH3[2] | — |
| Source Type | IHC Enlarged Chamber[2] | — |
| Oven Capabilities | Yes, No ovens fitted to source[2] | — |
| Source Magnet | 5A[2] | — |
| Dual Extraction | Bellows, 60 kV, 160 kV max[2] | — |
| Post Acell | Total Energy: 200 kV Max[2] | — |
| Plasma Flood Gun | Standard[2] | — |
| PH3 | SDS[2] | — |
| AsH3 | SDS[2] | — |
| Configuration (160 XP Ion variant) | — | 150mm High Current IMP[1] |
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