Comparison ledger
Branson 101-149-053 Gold Booster, Finetech Fineplacer Lambda, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | Fineplacer LambdaFinetech |
|---|---|---|
| OEM | Branson | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Finetech Fineplacer Lambda |
| Specifications | ||
| Configuration | 1:1.5[1] | HDD and Software[4] |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Placement accuracy | — | sub-micron[5] |
| Bonding force | — | 500 N[4] |
| Bonding technologies | — | Thermocompression, ultrasonic/thermosonic, ACF bonding, UV cure, C4 chip bonding[6] |
| Vision alignment system | — | Dual-image overlay with stationary beam splitter[6] |
| Substrate size (max) | — | 50 mm square[7] |
| Die size (min) | — | 2–3 mm[7] |
| Substrate thickness range | — | 0 to 10 mm[6] |
| Heated stage option | — | available[7] |
| Heated placement tool option | — | available[7] |
| Bonding technology | — | die bonding (as die bonder)[4] |
| Force option | — | 500N Force[4] |
| Vision system | — | patented advanced Vision Alignment System[6] |
| Alignment principle | — | imaging two orthogonal images simultaneously into one common image plane[6] |
| System type | — | sub-micron bonding system[6] |
| Module interface | — | Finetech Module Interface (FMI)[6] |
| Mains voltage | — | Mains voltage out, max 10A load (fuse)[6] |
| Accessory optics | — | special optics for positioning large fine pitch devices, high magnification systems[6] |
| Maximum bonding force | — | 500 N[4] |
| Interface | — | RS-232[6] |
| Vacuum | — | Built-in vacuum pump[6] |
| Adjustment set resolution | — | 1 µm[6] |
| Maximum force | — | 500N[4] |
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