Finetech
Fineplacer Lambda
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Finetech Fineplacer Lambda is a die bonder that provides sub-micron placement accuracy. The Fineplacer Lambda supports thermocompression and ultrasonic bonding technologies. The Fineplacer Lambda can deliver up to 500 N of bonding force.[1][2]
Power
Mains voltage out, max 10A load (fuse)[3]
Vacuum
Built-in vacuum pump[3]
Performance
sub-micron[1]
Optics
1 µm[3]
What it is
The Finetech Fineplacer Lambda is a sub-micron bonding system used for die bonding and flip-chip assembly. The system is manually operated. The Fineplacer Lambda provides sub-micron placement accuracy.[3][1][5]
How it works
The Fineplacer Lambda uses a patented advanced Vision Alignment System. The system images two orthogonal images simultaneously into one common image plane using a stationary beam splitter. The system supports multiple bonding technologies including thermocompression bonding, ultrasonic or thermosonic bonding, anisotropic conductive film (ACF) bonding, UV cure bonding, and bonding of C4 (controlled collapse chip connection) chips. The system is equipped with heating modules and bonding force applicators.[3][1]
Where it fits in the process flow
General reference — not yet source-verifiedDie bonders are used in the semiconductor packaging process flow after wafer dicing and before wire bonding or encapsulation. The Fineplacer Lambda places individual dies or components onto substrates or packages. The system aligns the die to the substrate using vision alignment and then applies heat and force to create the bond. Downstream processes include wire bonding, encapsulation, and final test.
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
Wafer handling2
Optics & imaging2
- Accessory optics
- special optics for positioning large fine pitch devices, high magnification systems[3]
Performance5
Control & software3
- HDD and Software[2]
Configuration & options13
- 500N Force[2]
- Added higher load cell table[2]
- Bonding technologies
- Thermocompression, ultrasonic/thermosonic, ACF bonding, UV cure, C4 chip bonding[3]
- Bonding technologies
- thermocompression, ultrasonic/thermosonic bonding, ACF bonding, UV cure, bonding of C4 chips[3]
- Bonding technologies
- Thermocompression, ultrasonic/thermosonic, ACF, UV cure, C4 chip bonding[3]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What placement accuracy does the Fineplacer Lambda provide?
The Fineplacer Lambda provides sub-micron placement accuracy.[1][4]
What bonding methods are supported?
The system supports thermocompression bonding, ultrasonic/thermosonic bonding, ACF bonding, UV cure, and bonding of C4 chips.[3]
What are the maximum substrate and minimum die sizes handled by standard tooling?
Standard tooling can handle dies as small as 2–3 mm and substrates up to 50 mm square.[4]
What is the maximum bonding force available?
The system can be configured with a bonding force of 500 N.[2]
Not publicly documented
The following facts about the Fineplacer Lambda are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Fineplacer Lambda are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Fineplacer Lambda are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Fineplacer Lambda are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Fineplacer Lambda are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Fineplacer Lambda is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]Inventory photo
- [3]manualslib.com — manualslib.commanualslib.com
- [4]research.rice.edu — research.rice.eduresearch.rice.edu
- [5]Наноиндустрия - научно-технический журнал - Наноиндустрия - Субмикронные системы монтажа FINEPLACER для высокоточной сборки — doi.orgdoi.org
- [6]Equipment inventory listing
Last updated Sep 26, 2026.
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