Waferpedia

Comparison ledger

2300 Flex 45versus1512e

Lam Research 2300 Flex 45, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2300 Flex 45Lam Research
1512eTegal
OEMLam ResearchTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research 2300Tegal 1512e
Specifications
ConfigurationMetal HP MWS[1]—
3 ChambersInsulating Film / Metal / Ashing[1]—
MakeLam[1]—
Model2300 Flex 45[1]—
Equipment typeEtcher[1]—
Chambers3 chambers[1]—
Process coverageInsulating film / Metal / Ashing[1]—
Gases used for insulating filmC4F8, CF4, CH3F[1]—
Gases used for metalCl2, BCl3[1]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com