Comparison ledger
Laurell 400-series, Laurell WS-650-23, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 400-seriesLaurell | WS-650-23Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | 1995 | — |
| Production run | 1995– | — |
| Lifecycle | Discontinued | — |
| Lifecycle milestones | 2011 End of life | — |
| Control system | — | — |
| Generation | — | — |
| Family | Laurell 400-series | Laurell WS-650-23 |
| Cited variants |
| |
| Specifications | ||
| Process controller | 400-series process controller capable of storing and automatically running process recipes consisting of run time and acceleration rate, with manual operation also supported[1] | — |
| Spin speed | 10,000 RPM (based on a 100 mm SEMI Std. wafer)[4] | — |
| Maximum wafer size | Up to 150 mm wafers[4] | — |
| Substrate size | 4" x 4" (102 mm x 102 mm) substrates[4] | — |
| Standard chuck | 1.75" (45 mm) diameter vacuum chuck[4] | — |
| Standard adapter coverage | One fragment adapter standard covering 10 mm through 150 mm SEMI wafers[1] | — |
| Housing material | Solid co-polymer blend exclusive to Laurell Technologies[1] | — |
| Power | 95 to 240 VAC, 47/63 Hz, ~300 Watts[1] | 95 to 240VAC, 47/63HZ, ~300 Watts[2] |
| Vacuum suggestion | 25–28 inches Hg vacuum with 4.5 SCFM flow at 0 inches Hg suggested[1] | — |
| Maximum substrate size | Ø150 mm wafers and 4" × 4" (102 mm × 102 mm) substrates[4] | 150 mm wafers, 5" × 5" (127 mm × 127 mm) substrates[2] |
| Maximum speed | 10,000 RPM (based on a Ø100 mm SEMI Std. wafer)[4] | — |
| Vacuum chuck diameter | 1.75" (45 mm) diameter vacuum chuck[1] | — |
| Fragment adapter coverage | 10 mm through 150 mm SEMI wafers[1] | — |
| Power requirement | 95 to 240VAC, 47/63HZ, ~300 Watts[1] | — |
| Model | — | WS-650-23 B Spin Coater[2] |
| Mounting | — | Station Mounted[2] |
| Wafer capacity | — | Up to ø 150 mm wafers[2] |
| Substrate capacity | — | 5" × 5" (127 mm × 127 mm) substrates[2] |
| Maximum rotational speed | — | 12,000 RPM (based on a ø 100 mm silicon wafer)[2] |
| Required N2 process/seal purge | — | 60–70 PSIG (4–5 bar) of Nitrogen/CDA[2] |
| Vacuum | — | 25–28 inches Hg; suggested flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[2] |
| Processes supported | — | Coating, Etching, Developing, Rinsing-Drying and Cleaning[2] |
| Vacuum requirement | — | 25–28 inches Hg (~635–711 mm Hg) with a flow volume of 4.5 SCFM (0.127 m³/min) at 0 inches Hg[2] |
| Seal/process purge gas | — | N₂ at 60–70 PSIG (4–5 bar)[2] |
| Gas consumption (standard motor) | — | 3 cubic feet per hour (0.085 m³/hour)[2] |
| Gas consumption (high-performance motor) | — | 20 cubic feet per hour (0.566 m³/hour)[2] |
Plan your fab
Building a Spin coater process? Get a complete equipment list.
Open the fab equipment planner →