Waferpedia

Comparison ledger

100 ICP FluorineversusSU 2000

Oxford Instruments 100 ICP Fluorine, SCREEN SU 2000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
SU 2000SCREEN
OEMOxford InstrumentsSCREEN
CategoryEtchEtch
Wafer size—6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments 100 ICP FluorineSCREEN SU 2000
Specifications
Etch GasesSF6, CF4, O2, Ar, N2, CHF3, C4F8[1]—
Cryo DRIE etch rateup to 5 µm/min[1]—
Wafer size4 inch, 6 inch, 8 inch (with clamp change)[1]Wafer currently configured for 6"[2]
Configuration—Under OEM Maintenance[2]
Station List—Lp, MPC1, MPC2, MPC3, MPC4, Reverser Unit, CR, PF, I/F (N2/air)[2]
Chemicals Used—Stripper, Qz, ST (also used for NMP in place of one)[2]
Application—Single wafer spray solvent tool[2]
Sation List—Lp, MPC1, MPC2, MPC3, MPC4, Reverser Unit, CR, PF, I/F (N2/air)[3]
Wafer Size—6 inch, 8 inch[2]
Chemicals—Stripper, Qz, ST, NMP[2]
Vintage—2017[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing