Comparison ledger
SUSS MicroTec ACS 300 Gen 2, YES 12-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACS 300 Gen 2SUSS MicroTec | 12-2P-CPYES |
|---|---|---|
| OEM | SUSS MicroTec | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec ACS 300 | YES 12-2P-CP |
| Cited variants | — | |
| Specifications | ||
| Configuration | Includes:[2] | — |
| Wafer size | System tooling for 200/300 mm semi spec wafer sizes[2] | 300 mm wafers[1] |
| OEM | SUSS MicroTec[3] | — |
| Model | ACS 300 Gen 2[4] | — |
| Equipment type | Coater / Developer[2] | — |
| Automation | fully automatic[3] | — |
| Architecture | modular[3] | — |
| Process modes | spin-coating and spray-coating[3] | — |
| Integrated functions | coat, bake, and develop modules[2] | — |
| Model designation | — | 12-2P-CP[1] |
| Series | — | YES-PB Series / 450PB Series[1] |
| Load type | — | manual load[5] |
| Application scope | — | MEMS and semiconductor process applications[6] |
| Cooling package | — | Air-only cooling package; no water[1] |
| Airflow | — | Vertical laminar airflow[1] |
| High vacuum | — | 10-6[1] |
| Maximum temperature | — | up to 450°C[1] |
| Interface | — | touch screen interface[6] |
| Tool type | — | manual-load high-temperature cure oven[5] |
| Process applications | — | MEMS and semiconductor process applications[5] |
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