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YES

12-2P-CP

Thermal / Diffusion300mmYES 12-2P-CP family
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The YES 12-2P-CP is a manual-load high-temperature cure oven. The YES 12-2P-CP is designed for MEMS and semiconductor process applications. The YES 12-2P-CP has a 300 mm wafer specification.[1][2]

YES12-2P-CP
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Wafer size

300mm

Vacuum

10-6[3]

What it is

The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.[1][2]

How it works

The PB Series uses vertical laminar airflow, a condensate trap assembly, and a cooling package to support solvent removal, particle reduction, and controlled ramp up and cool down behavior.[3][1][2]

Where it fits in the process flow

The PB Series is used for wafer-level packaging, redistribution layers, copper annealing, low-k dielectric cure, copper oxide removal, aluminum annealing, and related cure steps.[1][2]

Applications

The PB Series is used for polyimide and PBO cure, BCB bake, low temperature polymer cure, copper anneal, low-k dielectric cure, copper oxide removal, and aluminum anneal.[1][2]

  • polyimide/PBO cure
  • BCB bake
  • low temp polymers cure
  • copper anneal
  • low-K dielectric cure
  • copper oxide removal
  • aluminum anneal
  • polyimide bake
  • dehydration bake
  • wirebond preparation
  • plasma cleaning

What do the numbers mean?

Vacuum & pumping1

High vacuum
10-6[3]
Accurate?

Wafer handling1

Wafer size
300 mm wafers[3]
Accurate?

Control & software1

Interface
touch screen interface[2]
Accurate?

Configuration & options9

Model designation
12-2P-CP[3]
Accurate?
Series
YES-PB Series / 450PB Series[3]
Accurate?
Load type
manual load[1]
Accurate?
Application scope
MEMS and semiconductor process applications[2]
Accurate?
Cooling package
Air-only cooling package; no water[3]
Accurate?
Airflow
Vertical laminar airflow[3]
Accurate?
Maximum temperature
up to 450°C[3]
Accurate?
Tool type
manual-load high-temperature cure oven[1]
Accurate?
Process applications
MEMS and semiconductor process applications[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
YES 6-2P-CP——Listed as a related spec option for 150 mm wafers.web.archive.org[3]
YES 8-2P-CP——Listed as a related spec option for 200 mm wafers.web.archive.org[3]
YES 12-2P-CP——Listed as a related spec option for 300 mm wafers.web.archive.org[3]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • High vacuum10-6[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What environmental controls are emphasized for cure processing in the PB Series?

The PB Series emphasizes removal of residual solvents, uniform temperature distribution, pressure control, a dry inert atmosphere, and control of heating and cooling rates.[1][2]

Not publicly documented

The following facts about the 12-2P-CP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 12-2P-CP are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 12-2P-CP are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 12-2P-CP are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 12-2P-CP is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 12-2P-CP are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
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Last updated Oct 5, 2026.

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