Comparison ledger
Tegal 900, Tegal 915, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 900Tegal | 915Tegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 1984– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 900 | Tegal 915 |
| Cited variants | — | |
| Specifications | ||
| Product line | 900 Series plasma etch system[2] | — |
| Wafer size | 3", 100mm–150mm[1] | 100mm[5] |
| Substrate handling | Handles both round and square substrates[2] | — |
| Use case | Defreckling and backside nitride etching[2] | — |
| Process type | Single wafer plasma RIE[1] | — |
| Type | plasma etch system[2] | Plasma barrel etcher[4] |
| Applications | defreckling and backside nitride etching[2] | — |
| Batch capacity | — | Six cassettes of 100 mm wafers (150 pcs.) and four cassettes of 125 mm and 150 mm wafers (100 pcs.)[4] |
| Feed gases | — | Two independent feed gases[4] |
| Reaction chamber temperature control | — | Up to 100 degrees C[4] |
| Production start | — | 1984[5] |
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