Waferpedia

Comparison ledger

Reflexion 3600versus3806 L

Applied Materials Reflexion 3600, GigaMat 3806 L, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: CMP, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
Reflexion 3600Applied Materials
3806 LGigaMat
OEMApplied MaterialsGigaMat
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials ReflexionGigaMat 3806 L
Specifications
CE Segregation (NonCu/Open/Cu)Cu[2]—
ConfigurationSW version:[2]With Water Jet[1]
Reflexion SoftwarePB59M3i2[2]—
MESA softwareCB22M3i2[2]—
ISRM softwareIB11g5b[2]—
FI robot type / controllerKawasaki[2]—
Load portTDK TAS 300 (2)[2]—
FI controllerAMAT VMICPCI-7326[2]—
Wet robot typeYaskawa WTM511-2-FWS02-V1-CU/0190-08246 (1)[2]—
Polisher MEI B/DAMAT 0100-00722 (3)[2]—
Polisher AIO B/DAMAT 0100-00396 (2)[2]—
Polisher DIO B/DAMAT 0100-01995 (7)[2]—
Platen DriverYaskawa SGDH-75 AE (3)[2]—
Cross DriverYaskawa SGDH-08 AE-S (1)[2]—
Pad Conditioner/HCLU DriverYaskawa SGDH-01 AE (7)[2]—
Head SWEEP DriverYaskawa SGDH-04 AE (4)[2]—
Head Rotation DriverSE 2 VOSTARCD CR 06250 (4)[2]—
Meg GeneratorKaijo 600 (1)[2]—
Mega HeaterOrion ETD 232-SA-A-UL (1)[2]—
Slurry arm TypeAMAT 0040-78378 (3)[2]—
MakeApplied Materials[2]—
ModelReflexion 3600[2]—
CategoryCMP (Chemical Mechanical Polisher)[2]—
CE SegregationCu[2]—
PC Arm assemblyAMAT 0010-25311 (3)[2]—
iScan EndPoint moduleAMAT 0010-37905[2]—
Vintage2011[2]—
Voltage—480 VAC[1]
Frequency—60 Hz[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing