Comparison ledger
Disco 321, Disco 841 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | 841 BackDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco 841 Back |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | — |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Wafer size range | — | 4 to 8 inches (100-200 mm)[4] |
| Grinding type | — | In-feed grinding with wafer rotation[4] |
| Number of spindles | — | 2[4] |
| Spindle speed range | — | 1000-7000 rpm[4] |
| Vertical stroke | — | 110 mm[4] |
| Chuck table type | — | Porous chuck table with vacuum chuck[4] |
| Grinding wheel diameter | — | 8 inches[4] |
| Cassette capacity | — | Two cassettes for loading/unloading[4] |
| Planarity accuracy (within wafer) | — | 0.0015 mm[4] |
| Compliance | — | EC CE marking and SEMI S2-93 (DFG841)[4] |
| Dimensions (W x D x H) | — | 1050 mm x 2150 mm x 1710 mm[4] |
| Electrical requirements | — | 200V, 3 Phase, 50/60 Hz[4] |
| CDA pressure | — | 0.5-0.8 MPa[4] |
| DI water pressure and flow | — | 0.2-0.3 MPa, 15 l/min or higher[4] |
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