Comparison ledger
Disco 321, Disco DFG 8830, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | DFG 8830Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DFG |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | — |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Configuration | — | In-Feed[4] |
| Phase | — | 3 Phase[4] |
| Wafer size | — | 6 inch, 8 inch[4] |
| Material | — | SiC (silicon carbide)[4] |
| Max workpiece size | — | ø150 mm[5] |
| Spindle quantity | — | 4[5] |
| Spindle power (Z1–Z3) | — | 6.3 kW[5] |
| Spindle speed (Z1–Z3) | — | 1,000–4,000 min⁻¹[5] |
| Work disc quantity | — | 5[5] |
| Dimensions (W×D×H) | — | 1,400 × 2,500 × 2,000 mm[5] |
| Weight | — | ≈6,000 kg[5] |
| Maximum workpiece size | — | 150 mm (6 inch)[5] |
| Wafer sizes supported | — | 6 inch and 8 inch[4] |
| Spindle count | — | 4[5] |
| Spindle speed range | — | 1,000 – 4,000 min⁻¹[5] |
| Number of work stations | — | 5[5] |
| Dimensions (W x D x H) | — | 1,400 x 2,500 x 2,000 mm[5] |
| Material compatibility | — | SiC[4] |
| In-feed capability | — | Yes[4] |
| Power supply | — | 3 Phase, 3 Wire + Ground, 60 A[4] |
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