Waferpedia

Comparison ledger

321versus7100 AD

Disco 321, Kulicke & Soffa 7100 AD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
321Disco
7100 ADKulicke & Soffa
OEMDiscoKulicke & Soffa
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 321Kulicke & Soffa 7100 AD
Cited variants—
Specifications
OEMDisco[2]—
Model321[2]—
Equipment typeWafer Dicing Saw[2]—
Facility contextCleanroom Instrumentation[2]—
Application areaNano and Micro Fabrication[2]—
LocationFNT 4.106[2]—
Wafer SizeUp to 6 inches[3]—
Spindle Power1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[4]—
Spindle Power (alternate)1500 Watt spindle[3]—
Non-Contact SetupNon Contact Setup[4]—
MicroscopeMicroscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[4]—
Broken Blade DetectionBroken Blade Detection[4]—
Light TowerIncludes Light Tower[4]—
Chuck Type6" Universal Chuck (or 6" Porous Film Frame Chuck)[3]—
Wafer size capabilityUp to 6" wafers[4]—
Chuck6-inch porous film frame chuck[3]—
Spindle power1500-watt spindle[3]—
FootprintSmall footprint[3]—
SetupNon-contact setup[4]—
Blade break detectionBroken blade detection[4]—
Other featuresFloppy drive, light tower, blade tools, manuals[4]—
VAC—200-240[5]
Configuration—50/60Hz,15Amps[5]
Power—VA 3500[5]
Voltage—200-240 VAC[5]
Frequency—50/60 Hz[5]
Current—15 Amps[5]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]tmi.utexas.edutmi.utexas.edu
  3. [3]jmind.comjmind.com
  4. [4]gtsaz.comgtsaz.com
  5. [5]inventory listing