Waferpedia

Comparison ledger

101versusTitan 4700

EV Group 101, Ultratech Titan 4700, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
Titan 4700Ultratech
OEMEV GroupUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 101Ultratech Titan 4700
Specifications
OEMEV Group[1]—
Model101[1]—
Equipment nameEVG 101 Spray Coater[1]—
NEMO IDevgspraycoat[1]—
Training requiredEVG 101 Training[1]—
Training duration1.50 hours[1]—
Processing techniqueResist Spray Coat (manual)[1]—
Cleanliness"All"[1]—
LocationSNF Paul G Allen L107 Cleanroom[1]—
Wafer diameter (substrate size)up to 300 mm[2]—
Available modulesSpin coat / OmniSpray® / develop[2]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[2]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]—
Processing technique (at SNF)Resist Spray Coat (manual)[3]—
Cleanliness group (at SNF)"All"[1]—
Optics—G and H line[4]
Lamp Power—1000 W[4]
Extended Focus Option—Yes (for thick resist exposure)[4]
Wafer Sizes Supported—4 inch, 5 inch, 6 inch, 8 inch[4]
Reticle Size—5 inch (upgradable to 6 inch)[4]
Maximum Field of View—44 mm x 26.7 mm[4]
Numerical Aperture—0.32[4]
Robot—Genmark[4]
Machine Vision System—Cognex[4]
Reticle Bar Code Reader—Yes[4]
Auto Aperture—For 2 or 3 field reticles[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]classoneequipment.comclassoneequipment.com
  5. [5]classoneequipment.comclassoneequipment.com