Comparison ledger
EV Group EVG 150, SUSS MicroTec ACS200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EVG 150EV Group | ACS200SUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | i-line | i-line |
| Family | EV Group EVG 150 | SUSS MicroTec ACS200 |
| Specifications | ||
| Tool type | Modular cluster tool for coating and development of i-line photoresists[1] | Modular cluster tool[2] |
| Loading/unloading ports | Two loading/unloading ports: one cassette for coating and one cassette for development[1] | Two loading/unloading ports: one cassette for coating and one cassette for development[2] |
| Wafer centering | Optical wafer centering station[1] | Wafer centering station[2] |
| Spin-coating modules | Three spin-coating modules: coater A, coater B, and coater C[1] | Two spin-coating modules[2] |
| Coater A use | Low-viscosity photoresist[1] | — |
| Coater B use | High-viscosity photoresist[1] | — |
| Coater C use | Bottom layers[1] | — |
| Development module | One development module with puddle and spray options[1] | One development module with puddle and spray options[2] |
| Hotplates and coolplates | Three stacks of hotplates (8 in total) and coolplates (3 in total)[1] | Two stacks of hotplates (9 in total) and coolplates (3 in total)[2] |
| HMDS priming | Additional HMDS-priming module[1] | Additional HMDS-priming module[2] |
| Robot | Dual end effector robot[1] | central robot feeding the individual processing modules[2] |
| Wafer handling | Standard SEMI-wafers of 100 mm and 150 mm diameter[1] | Standard SEMI-wafers of 100 mm and 150 mm diameter[2] |
| Substrate types | Opaque wafers (silicon, SOI) or transparent wafers (glass, fused-silica, sapphire)[1] | — |
| Process stability features | Airborne molecular contamination (AMC) filter and active control of chamber and resist/developer lines temperature[1] | — |
| Available photoresists | AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, MC PC62E[1] | — |
| Available bottom layers | LOR 5A, LOR 15C, XHRiC-16 II[1] | — |
| Surface preparation options | HMDS, dehydrate, or none[1] | — |
| Solvent clean options | Standard or edge bead removal (EBR)[1] | — |
| Developer chemistries | AZ 726 MIF, AZ 400K 1:3.5, AZ developer III[1] | — |
| wafer diameter | 100mm and 150mm[1] | — |
| loading/unloading ports | Two (one cassette for coating, one for development)[1] | — |
| wafer centering station | Optical wafer centering station[1] | — |
| spin-coating modules | Three (coater A: low-viscosity PR, coater B: high-viscosity PR, coater C: bottom layers)[1] | — |
| development module | One, with both puddle and spray options[1] | — |
| hotplates | Three stacks, 8 in total[1] | — |
| coolplates | Three stacks, 3 in total[1] | — |
| additional module | HMDS-priming module[1] | — |
| wafer types | Opaque (silicon, SOI) or transparent (glass, fused-silica, sapphire)[1] | — |
| process enhancement | AMC filter and active control of chamber and resist/developer line temperature[1] | — |
| Wafer sizes | 100mm and 150mm diameter[1] | — |
| Loading ports | Two loading/unloading ports[1] | — |
| Hotplates | Three stacks, 8 total[1] | — |
| Coolplates | Three total[1] | — |
| HMDS-priming module | Included[1] | — |
| Wafer types | Opaque (silicon, SOI) and transparent (glass, fused-silica, sapphire)[1] | Opaque (silicon, SOI) and transparent (glass, fused-silica, sapphire)[2] |
| AMC filter | Airborne molecular contamination filter on top[1] | — |
| Temperature control | Active control of chamber and resist/developer lines temperature[1] | — |
| Photoresists available | AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, MC PC62E; bottom layers: LOR 5A, LOR 15C, XHRiC-16[1] | AZ ECI 3007, AZ ECI 3027, AZ 10XT-20, AZ 10XT-60, AZ 15nXT, AZ 40XT[2] |
| Wafer size | 100mm and 150mm[1] | — |
| Photoresist type | i-line[1] | i-line[2] |
| Process enhancement | Airborne molecular contamination filter and active control of chamber and resist/developer line temperature[1] | — |
| Priming module | Additional HMDS-priming module[1] | — |
| Wafer diameter | 100 mm and 150 mm diameter[1] | — |
| Process | — | Coating and development of i-line photoresists[2] |
| Supported wafer materials | — | Opaque wafers (silicon, SOI) and transparent wafers (glass, fused-silica, sapphire)[2] |
| Wafer diameter supported | — | 100mm and 150mm (on request)[2] |
| Number of spin-coating modules | — | 2[2] |
| Number of development modules | — | 1[2] |
| Number of hotplates | — | 9 (total across two stacks)[2] |
| Number of coolplates | — | 3[2] |
| HMDS priming module | — | Yes (included)[2] |
| Robot model | — | Sankyo SC5000[2] |
| Voltage | — | 400 V[3] |
| Phase | — | 3 Phase[3] |
| Frequency | — | 60 Hz[3] |
| Thermal modules | — | Two stacks of hotplates (9 in total) and coolplates (3 in total), including an additional HMDS-priming module[2] |
| Wafer material | — | Opaque wafers (silicon, SOI) and transparent wafers (glass, fused-silica, sapphire)[2] |
| Central robot | — | Individual processing modules are fed by a central robot[2] |
| Supported wafer diameters | — | 100 mm and 150 mm diameter[2] |
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