SUSS MicroTec
ACS200
The SUSS MicroTec ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists. The SUSS MicroTec ACS200 GEN3 can handle standard SEMI wafers of 100 mm and 150 mm diameter on request. The SUSS MicroTec ACS200 GEN3 includes two spin-coating modules and one development module with puddle and spray options.[1]
Plate 01ACS200 Gen3 TE Coater & Developer - Fully Automated Platform for Maximum Throughput
SUSSWatch on YouTube
What it is
The Süss ACS 200 Gen3 is a modular cluster tool for coating and development of i-line photoresists.[1]
It is configured with two loading and unloading ports, a wafer centering station, two spin-coating modules, one development module with puddle and spray options, two stacks of hotplates and coolplates, and an additional HMDS-priming module.[1]
How it works
The individual processing modules are fed by a central robot.[1]
Sequences consist of specific flows of sub-recipes running in individual modules. Several sequences, started from a single or both cassettes, can be active in parallel, and the flow is managed in real time by the software and optimized for maximum throughput or for prioritization of critical steps.[1]
Where it fits in the process flow
The tool can handle standard SEMI-wafers of 100 mm and 150 mm diameter on request, including opaque wafers such as silicon and SOI, and transparent wafers such as glass, fused silica, and sapphire.[1]
The process-flow library includes sections for PR coating on 4-inch wafers, PR development on 4-inch wafers, PR coating and development on 6-inch wafers with configuration request, high-topography recipes, preventive maintenance and development, and user custom sequences.[1]
Applications
The ACS 200 is used for coating and development of i-line photoresists.[1]
Photoresists currently available on the ACS 200 are AZ ECI 3007, AZ ECI 3027, AZ 10XT-20, AZ 10XT-60, AZ 15nXT, and AZ 40XT.[1]
- Coating
- Development
- Photolithography
What do the numbers mean?
Power & electrical3
Wafer handling14
- Loading/unloading ports
- Two loading/unloading ports: one cassette for coating and one cassette for development[1]
- Supported wafer materials
- Opaque wafers (silicon, SOI) and transparent wafers (glass, fused-silica, sapphire)[1]
- Wafer material
- Opaque wafers (silicon, SOI) and transparent wafers (glass, fused-silica, sapphire)[1]
- Wafer types
- opaque wafers such as silicon and SOI, or transparent wafers such as glass, fused-silica, and sapphire[1]
Gas & chemistry1
Configuration & options15
- Hotplates and coolplates
- Two stacks of hotplates (9 in total) and coolplates (3 in total)[1]
- Photoresists available
- AZ ECI 3007, AZ ECI 3027, AZ 10XT-20, AZ 10XT-60, AZ 15nXT, AZ 40XT[1]
- Thermal modules
- Two stacks of hotplates (9 in total) and coolplates (3 in total), including an additional HMDS-priming module[1]
- Thermal modules
- two stacks of hotplates (9 total) and coolplates (3 total), including an additional HMDS-priming module[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes can the ACS200 Gen3 handle?
The tool can handle standard SEMI wafers of 100mm and 150mm diameter on request.[1]
Does it include an HMDS-priming module?
Yes, the tool has an additional HMDS-priming module.[1]
How many spin-coating modules does it have?
The tool is equipped with two spin-coating modules.[1]
How are process sequences managed?
Sequences are stored in a database library organized into 10 sections of 1000 recipes. The flow is managed in real time by the software.[1]
Not publicly documented
The following facts about the ACS200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ACS200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ACS200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ACS200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ACS200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ACS200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]Inventory photo
- [3]Inventory photo
- [4]XB8 Permanent Bonder | SUSS — suss.com (Nov 13, 2024)web.archive.org
Last updated Oct 8, 2026.
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