100mm

The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.

Heidelberg Instruments VPG200 is a laser pattern generator used for mask production, direct exposure on SEMI-standard wafers, and mask reticles.

The SUSS MicroTec MJB4 is a manual mask/wafer aligner for research and development that aligns and exposes wafers up to 4 inch (100 mm) diameter.

The SUSS ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists.

The EVG 150 is a modular cluster tool for coating and development of i-line photoresists.

The Oxford PlasmaPro 100 Cobra is an etcher with 8 inch wafer size, an ICP chamber with Cl2 and BCl3 capability, and three RIE chambers.

TEL Unity Me is an automatic plasma etching production tool from Tokyo Electron, configured at CMi with a 100mm wafer cassette loader, a transfer chamber, and a DRM process module.

The Plasma-Therm 770 SLR series is an inductively coupled plasma (ICP) etch system used for dry etching of materials such as silicon, SiO₂, Si₃N₄, and compound semiconductors.

The Disco DAD321 is an automatic dicing saw for silicon, glass, and pyrex wafers, with support for 100 mm and 150 mm wafers.

The ESI 3511 is a microwave downstream plasma asher used for high-rate polymer ashing and wafer backside cleaning on 100 mm wafers.

The Temescal FC-2000 is a load-locked bell jar deposition system for small-scale production and R&D, with listed substrate fixtures for 2-inch, 3-inch, 100-mm, and 150-mm wafers.

The Logitech PM5 is a polishing and lapping machine used for sample preparation.

The Pfeiffer Adixen ACP28G is a compact dry rotary lobe vacuum pump designed for pumping traces of corrosive gas, featuring a frictionless multi-stage roots design and an integrated frequency converter.

Tokyo Electron Clean Track ACT-8 is an industry-standard wafer coater and developer used in a DUV lithography cluster with an in-line exposure unit interface.

The Disco DCS1440 is an automatic cleaning system designed to clean workpieces cut on a dicing saw, supporting a diverse range of workpiece sizes and offering configurable cleaning sequences.

The Applied Materials P 5000 cluster tool is a dry etching system for 100mm wafers.

The Onto Innovation IVS 280 System provides overlay, CD, and height metrology for 100mm to 200mm wafers in compound semiconductor, power devices, RF, MEMS, and LED markets.

The PlasmaLab M80 Plus – Chlorine is an open load reactive ion etch system for etching compound semiconductors and metals.

The STS 310 is a plasma-enhanced chemical-vapor-deposition system used in the source to deposit silicon dioxide and silicon nitride films.

The Tegal 6550 is a plasma etch reactor/system for etching non-volatile metal and metal oxide films, with a dual-chamber platform and patented rinse-strip-rinse capability.

The Tegal 900 is a plasma etch system used for applications including defreckling, backside nitride etching, and processing III-V materials.

The Tegal 903 ACS is a diode plasma etch tool for semiconductor processing with a wafer size range of 3 inches, 100 mm to 150 mm.

The Tegal 915 is a plasma barrel etcher with batch capacity for 100 mm, 125 mm, and 150 mm wafers.

EP1 is a Logitech chemical mechanical polishing cloth and pad product suitable for a wide range of applications, including oxide, nitride, and copper.

The Tegal 6510 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.

The Tegal 6520 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.

The OAI 808 Aligner is a semi-automated, four-camera, optical front- and backside mask aligner with stated alignment accuracy of 1µm to 2µm.

Oxford PlasmaPro100 is an ICP plasma etcher for 100mm wafers used for chlorine and bromine chemistry.

The Tegal 6540 is a high-density plasma etch system used for etching difficult-to-etch materials in MEMS and related semiconductor applications.

The Pfeiffer ATH1603M is a magnetically levitated turbomolecular pump used for high vacuum applications.

The Karl Suss MA-4 is a contact/proximity mask aligner used for substrates up to 4" (100mm) in diameter.

The STS Multiplex ICP is a load-locked inductively coupled plasma etch system used for deep silicon etching using the Bosch process.

ASML PAS 5500/300 is a deep-UV stepper photolithography tool configured for 4-inch wafers.

The Logitech APD1 is a combined annular and peripheral precision saw for slicing wafers, crystals, semiconductor components, and other materials with minimal kerf loss and surface damage.

The Signatone S-302-4 is a four point resistivity probe station used for sheet resistance and resistivity measurements of substrates and thin films.

The GCA 6100 C Wafer Stepper is a lithography tool for 100 mm wafers with a 150 mm X/Y stage travel and an AWH1 automatic wafer handler.

The OAI Model 800 Mask Aligner is a semi-automated, four-camera, optical front- and backside mask aligner with motorized backside focus, motorized auto leveling, and auto gap setting.

The Pfeiffer HiPace300 is a turbo pump used as the secondary pump in the loadlock of the Alliance-Concept EVA 451 thermal evaporator.