ESI
Wafer size
100mm
Gas delivery
Oxygen, forming gas[1]
The ESI 3511 uses oxygen and forming gas chemistry. The ESI 3511 is specified for high rate polymer ashing on wafer topsides.[1]
Documented failure modes, common issues, and field considerations.
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Many such systems are designed to handle the heavily cross-linked skin that forms on resist after high-dose implantation. The combination of reactive oxygen radicals and controlled heating can effectively remove that crust. However, process parameters (temperature, gas mixture, power) must be tuned to achieve complete removal without leaving residues.
Oxygen is the primary gas for organic ashing. Fluorine‑containing additives such as CF₄ or NF₃ are sometimes introduced in small percentages to increase the strip rate or to attack certain residues. In some applications, forming gas (N₂/H₂) is used for reducing environments. The gas choice depends on the material stack and the specific residues to be removed.
Throughput is highly dependent on the chamber design, wafer size, and strip process recipe. In general, batch-type microwave downstream ashers can process multiple wafers simultaneously, offering moderate throughput. Single-wafer configurations provide higher process uniformity but lower wafer counts per hour. The actual throughput for a given tool is determined by its specific operating characteristics and the strip time needed for the application.
The following facts about the 3511 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3511 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3511 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3511 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 3511 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 3511 are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 3, 2026.