Waferpedia

Tool family

Disco DFL

Models in this family

  1. The Disco DFL 7361 is a laser saw with a Type FX laser head, BSS-6 optics system, and integrated wafer cleaning system with atomizing nozzle.

    Cited variants

    DesignationGenerationVintageChangesSource
    SECS/GEM Software——Listed as an option.Equipment inventory listing[1]
    Intemal lighting——Listed as an option.Equipment inventory listing[1]
    Virus-free PC——Listed as an option.Equipment inventory listing[1]
    STM DFL7161 2021 SW unified——Listed as an option.Equipment inventory listing[1]
    Barcode reading function for auto recipe loading——Listed as an option.Equipment inventory listing[1]
    Compatibility with Hogomax 5L tanks——Listed as an option.Equipment inventory listing[1]
    Change of Laser Focus Position for Maintenance——Listed as an option.Equipment inventory listing[1]
    Additional Kerf check sequence——Listed as an option.Equipment inventory listing[1]
    Password Modification up to Level 4——Listed as an option.Equipment inventory listing[1]
    Disco CO2 Injector + Integration specs——Listed as an option.Equipment inventory listing[1]
    CO2 injector (stand-alone) added——Listed as an option.Equipment inventory listing[1]
    Addition of drain valve for CO 2 injector specific resistance value stabilization——Listed as an option.Equipment inventory listing[1]
    CO2 water target resistivity value Settable in device data——Listed as an option.Equipment inventory listing[1]
    CO2 bubbler support (RS232C)——Listed as an option.Equipment inventory listing[1]
    New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)——Listed as an option.Equipment inventory listing[1]
    DFL7360——Different dimensions (1,715 x 3,265 x 1,998 mm) and weight (approx 2,770 kg); X-axis feed speed 1.0 - 1,000 mm/sweb.archive.org[2]
    DFL7360FH——Different dimensions (1,100 x 2,100 x 1,990 mm) and weight (approx 2,090 kg)web.archive.org[2]
    DFL7341——Corresponding to 200mm workpiece; maximum workpiece size ø200web.archive.org[2]
    DFL7340——Corresponding to 200mm workpiece; maximum workpiece size ø200web.archive.org[2]
    DFL7161——Mentioned as DFL7161 model with related specifications and in options text as target of some upgradesEquipment inventory listing[1]
  2. The Disco DFL 7560 L is a laser saw with robot wafer handling, stated for 2-inch to 4-inch wafers.

    Cited variants

    DesignationGenerationVintageChangesSource
    200mm Fully Automatic wafer handling from/to standard wafer cassette——Machine modification includes 200mm fully automatic wafer handling from/to standard wafer cassette, chuck for 200mm wafers, new robot design for handling heavier wafers, new CE marking, 6 inch lens, and new Galvo Scanner.Equipment inventory listing[3]

All entries

  1. DFL 7161 FXDisco
    CategoryDicing & Grinding
    5 specs
  2. DFL 7361Disco

    The Disco DFL 7361 is a laser saw with a Type FX laser head, BSS-6 optics system, and integrated wafer cleaning system with atomizing nozzle.

    CategoryDicing & GrindingWaferIntegrated Wafer Cleaning System with Atomizing Nozzle
    62 specs
  3. DFL 7560 LDisco

    The Disco DFL 7560 L is a laser saw with robot wafer handling, stated for 2-inch to 4-inch wafers.

    CategoryDicing & GrindingWaferRobot Wafer handling
    37 specs

Sources

Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]Equipment inventory listing