Waferpedia

Disco

DFL 7560 L

DFL 7560 L — Inventory photo
Fig. 01DFL 7560 LInventory photo[1]

Wafer size

Robot Wafer handling

Power

1[1]

Performance

0.002 mm[1]

What it is

The DFL 7560 L is a fully automatic system. The system handles workpieces up to 150 mm in diameter. The DFL 7560 L includes robot wafer handling. The system features a touch panel LCD monitor. The DFL 7560 L uses linear scale closed loop control on the X and Y axes. The Z axis has a positional repeatability of 0.002 mm. The dimensions of the DFL 7560 L are 2000 mm by 1810 mm by 1800 mm. The system weighs approximately 3300 kg.[1][3]

How it works

The DFL 7560 L incorporates a laser power supply with built-in water cooled chillers. An external chiller unit supplies cooling water to the laser power supply. A separate chiller unit provides cooling water to the X axis. The system uses a high and low magnification microscope with LED illumination for alignment. The X and Y axes use linear scale closed loop control for positioning.[1]

Applications

The DFL 7560 L is applied in Laser Lift-off for high brightness vertical structured LED manufacturing. The DFL 7560 L handles sapphire wafers for separation.[1][3]

What do the numbers mean?

Power & electrical7

Step-down Transformer 400 V, 3 phases, 50 Hz[1]
Accurate?
Laser power supply with built in water cooled chillers[1]
Accurate?
Chiller unit to supply cooling water for Laser power supply[1]
Accurate?
Uninterruptible Power Supply
1[1]
Accurate?
Power Supply
Step-down Transformer 400 V, 3 phases, 50 Hz[1]
Accurate?
Laser Cooling
Laser power supply with built in water cooled chillers[1]
Accurate?
Additional Chiller
Chiller unit to supply cooling water for Laser power supply[1]
Accurate?

Wafer handling10

Wafer size
Robot Wafer handling[1]
Accurate?
Wafer
Can be modified at later date to 3”, 4” & 6” wafers and frame[1]
Accurate?
Wafer size
200mm Fully Automatic wafer handling from/to standard wafer cassette[1]
Accurate?
Chuck for 200mm wafers[1]
Accurate?
New robot design for handling heavier wafers[1]
Accurate?
Wafer size
New CE marking 6 inch Lens and new Galvo Scanner Sapphire wafer deposited in stocker[1]
Accurate?
Wafer Sizes (standard)
2, 3, 4 inch[1]
Accurate?
Wafer Size Modification
Can be modified to 3”, 4” & 6” wafers and frame[1]
Accurate?
Robot Wafer Handling
Yes[1]
Accurate?
Optional Upgrade
200 mm Fully Automatic wafer handling from/to standard wafer cassette, Chuck for 200mm wafers, New robot design for handling heavier wafers, 6 inch Lens and new Galvo Scanner[1]
Accurate?

Optics & imaging2

Low and High Magnification microscope with LED illumination[1]
Accurate?
Microscope
Low and High Magnification microscope with LED illumination[1]
Accurate?

Performance2

Z axis positional repeatability 0.002mm Options: 1[1]
Accurate?
Z Axis Positional Repeatability
0.002 mm[1]
Accurate?

Control & software3

X and Y axis with linear scale closed loop control[1]
Accurate?
Operation Interface
Touch panel LCD monitor[1]
Accurate?
Axis Control
X and Y axis with linear scale closed loop control[1]
Accurate?

Dimensions & facilities4

Chiller unit to supply cooling water to X axis[1]
Accurate?
Dimensions (W x D x H)
2,000 x 1,810 x 1,800 mm[3]
Accurate?
Weight
approx. 3,300 kg[3]
Accurate?
X Axis Chiller
Chiller unit to supply cooling water to X axis[1]
Accurate?

Configuration & options9

Operation by touch panel LCD monitor[1]
Accurate?
Signal tower[1]
Accurate?
CE-marking[1]
Accurate?
Operation and troubleshooting manuals[1]
Accurate?
Machine modification includes:[1]
Accurate?
Standard Accessories Include:[1]
Accurate?
Maximum Workpiece Size
ø150 mm[3]
Accurate?
Processing Mode
Fully automatic[3]
Accurate?
CE Marking
Yes[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
200mm Fully Automatic wafer handling from/to standard wafer cassette——Machine modification includes 200mm fully automatic wafer handling from/to standard wafer cassette, chuck for 200mm wafers, new robot design for handling heavier wafers, new CE marking, 6 inch lens, and new Galvo Scanner.Equipment inventory listing[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationStep-down Transformer 400 V, 3 phases, 50 Hz[1]
  • ConfigurationLaser power supply with built in water cooled chillers[1]
  • ConfigurationChiller unit to supply cooling water for Laser power supply[1]
  • Uninterruptible Power Supply1[1]
  • Power SupplyStep-down Transformer 400 V, 3 phases, 50 Hz[1]
  • Laser CoolingLaser power supply with built in water cooled chillers[1]
  • Additional ChillerChiller unit to supply cooling water for Laser power supply[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the Z-axis positional repeatability of the DFL 7560 L?

The Z-axis positional repeatability is 0.002 mm.[1]

What power supply is required for the DFL 7560 L?

The DFL 7560 L requires a 400 V, 3-phase, 50 Hz power supply.[1]

What are the typical applications of the DFL 7560 L?

The DFL 7560 L is used for Laser Lift-off in high brightness vertical structured LED manufacturing and for sapphire wafer separation.[1][3]

Not publicly documented

The following facts about the DFL 7560 L are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7560 L are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the DFL 7560 L are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DFL 7560 L are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DFL 7560 L is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the DFL 7560 L are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]web.archive.org — disco.co.jp (Feb 22, 2020)web.archive.org
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Last updated Oct 2, 2026.

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