Agilent
350 D
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Agilent 350 D is a high-current ion implanter for semiconductor fabrication. The Agilent 350 D processes 150 mm wafers.[1]
What it is
How it works
General reference — not yet source-verifiedIon implanters generate a beam of ionized dopant species from a source.
The beam passes through a mass analyzer to select the desired ion species.
Where it fits in the process flow
General reference — not yet source-verifiedIon implantation is a doping step typically performed after photolithography and before thermal annealing in front-end-of-line processing.
The machine introduces dopant atoms into the semiconductor substrate to modify electrical properties.
Applications
General reference — not yet source-verifiedIon implanters are used for source and drain doping, well formation, and threshold voltage adjustment in integrated circuits.
What do the numbers mean?
Wafer handling1
Configuration & options3
- Has run 100mm[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 350 D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 350 D are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 350 D are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 350 D are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 350 D are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 350 D is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Inventory photo
- [3]waferpedia.comwaferpedia.com
Last updated Oct 8, 2026.
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