Applied Materials
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Dry etch systems remove material from a wafer surface using plasma-based processes rather than wet chemicals.
Etch tools are employed in semiconductor fabrication to transfer patterns from a mask or photoresist into underlying layers.
Dry etch systems are typically placed after photolithography and before resist stripping or subsequent deposition steps.
Polymer etch is used in the fabrication of microelectronic devices where polymer materials are part of the device structure.
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The following facts about the Centura MXP Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura MXP Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura MXP Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura MXP Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura MXP Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura MXP Dry is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 29, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.