Applied Materials
PREXT Dry
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA dry etcher generates a low-pressure plasma by applying radio-frequency power to a process gas inside a vacuum chamber. Reactive radicals and ions produced in the plasma strike the wafer surface, reacting with the exposed material and volatilizing it. The process can be tuned for anisotropic etching by adjusting gas chemistry, pressure, and power.
Where it fits in the process flow
General reference — not yet source-verifiedDry etchers are used after lithographic patterning to transfer the resist image into the underlying layer. Downstream steps typically include resist stripping, wet cleaning, and metrology or inspection. The etcher is part of the etch module, which may also include wet etching and ashing tools.
Applications
General reference — not yet source-verifiedDry etchers are employed to etch a variety of materials, including silicon, dielectrics, and metals, in processes such as gate etching, contact etching, and trench formation. The PREXT Dry is expected to handle similar applications within the etch segment.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the PREXT Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the PREXT Dry are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PREXT Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the PREXT Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the PREXT Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PREXT Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]PREXT Dry — Applied Materials | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
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