ASML
PAS 5500 300 C DUV
The ASML PAS 5500/300 C DUV is a deep-ultraviolet wafer stepper. The ASML PAS 5500/300 C DUV uses a 248 nm lens column with 0.63 N.A. The ASML PAS 5500/300 C DUV accommodates wafer sizes from 3 inch up to 200 mm.[1][2]
What it is
How it works
The ASML PAS 5500 300 C DUV uses a DUV lens column at two hundred forty eight nanometers and a Zeiss lens with variable numerical aperture.[1]
The ASML PAS 5500 300 C DUV performs step and repeat exposure with laser-controlled stage motion.[1]
The ASML PAS 5500 300 C DUV supports annular illumination modes and backside alignment.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe ASML PAS 5500 300 C DUV sits in the lithography module of the fab flow, where it exposes patterned resist on a wafer before later pattern transfer steps.
The ASML PAS 5500 300 C DUV is used after mask preparation and resist coating and before subsequent development and etch or deposition steps.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Stage interferometer needs to be replaced.
What do the numbers mean?
Wafer handling3
Optics & imaging17
Performance2
- Alignment
- Registered alignment is typically <0.045 µm, even when using backside alignment[1]
Configuration & options23
- Can be configured for 3" - 6"[2]
- Upgraded workstation[2]
- Extended N/A Option[2]
- Stage Interferometer Bad[2]
- CM Options:[2]
- REFL Img Sensor[2]
- PEP 1 Productivity upgrade[2]
- PEP 2 productivity upgrade[2]
- Flatness Model[2]
- LSQ Disto Model[2]
- Mark sensor[2]
- Batch streaming[2]
- Intensity 2[2]
- Aerial Key[2]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| PAS 5500/300C | DUV | 1996 | Can be configured for 3 inch to 6 inch wafers; upgrade to 5500/300C via lens upgrade; upgraded workstation; extended N/A option; Cymer 5600 laser; laser chamber changed; laser path optics recently replaced; CM options listed include REFL Img Sensor, PEP 1, PEP 2, reticle error compensation, flatness model, LSQ Disto Model, mark sensor, batch streaming, intensity 2, aerial key, extended NA range, focal adjustment, alignment reports, annular illumination, scribblelane marks, library, and visual alignment camera. | Equipment inventory listing[2] |
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- DUV Resist InformationDocumentcornell.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the minimum feature size achievable?
Minimum feature size is less than 0.20 µm.[1]
What wafer sizes are supported?
Wafer sizes from 3 inches up to 200 mm can be accommodated.[1]
What is the reduction ratio of the lens?
The lens provides a 4:1 reduction.[1]
What is the exposure field size?
The field size is 22 mm by 22 mm.[1]
What type of masks does the system use?
The system uses 6-inch by 0.250-inch thick quartz masks.[1]
Not publicly documented
The following facts about the PAS 5500 300 C DUV are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PAS 5500 300 C DUV are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the PAS 5500 300 C DUV are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the PAS 5500 300 C DUV is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the PAS 5500 300 C DUV are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
- [2]Inventory photo
- [3]Equipment Resources | CNF — cnf.cornell.educnf.cornell.edu
Last updated Oct 11, 2026.
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