Disco
DFD 641 Fully Automatic Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Disco DFD 641 is a fully automatic dicing saw.[1]
How it works
General reference — not yet source-verifiedDicing saws operate with a rotating blade that contains diamond abrasive particles. The blade is lowered through the wafer along programmed streets between the dice, cutting through the wafer thickness. Wafer mounting on a dicing tape supports the dies after cutting. The spindle is typically air-bearing mounted for high rotational accuracy. A vision system aligns the wafer to the blade using alignment marks. Water coolant is sprayed on the cutting zone to remove heat and debris. Fully automatic machines incorporate automated cassette-to-cassette wafer handling.
Where it fits in the process flow
General reference — not yet source-verifiedDicing is performed in the back-end semiconductor manufacturing flow after the wafer has been thinned by grinding or polishing. The singulated dies are then transferred to subsequent assembly steps such as die attach, wire bonding, and encapsulation. In some flows, dicing may occur before or after other back-end processes like backside coating or wafer-level testing.
What do the numbers mean?
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the DFD 641?
The DFD 641 is a fully automatic dicing saw.[1]
Not publicly documented
The following facts about the DFD 641 Fully Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 641 Fully Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 641 Fully Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 641 Fully Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 641 Fully Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 641 Fully Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Sep 26, 2026.
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