Waferpedia

Disco

DFL 7160 Automatic

Dicing & GrindingDisco DFL 7160 family
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The Disco DFL 7160 Automatic is an automatic laser saw for 12-inch wafers. The Disco DFL 7160 Automatic has one cassette port. The Disco DFL 7160 Automatic supports circular ring cutting of Taiko wafers.[1][2]

DFL 7160 Automatic — Inventory photo
Fig. 01DFL 7160 AutomaticInventory photo[3]

What it is

The Disco DFL 7160 Automatic is an automatic laser saw for 12-inch wafers.[8][1][2]

The DFL 7160 is a member of the Disco DFL 7160 family and is categorized under Dicing & Grinding equipment.[1][2]

How it works

The DFL 7160 Automatic is an automatic machine that performs dicing by laser.[8][2]

The system includes one cassette port, from which wafers are handled automatically for processing.[8][2]

The machine supports circular ring cutting of Taiko wafers.[8][2]

Where it fits in the process flow

General reference — not yet source-verified

Laser saws of this class singulate semiconductor wafers into individual die.

Applications

The DFL 7160 Automatic is used for dicing applications in semiconductor manufacturing.[8][2]

The tool is configured for 12-inch wafers and for the circular ring cutting of Taiko wafers, a process used on wafers that have been thinned with a reinforced ring-shaped edge.[8][2]

What do the numbers mean?

Wafer handling5

1 Cassette port[8]
Accurate?
Circular ring cutting of Taiko wafers[8]
Accurate?
Wafer Size
12 inch[8]
Accurate?
Cassette Ports
1[8]
Accurate?
Circular Ring Cutting of Taiko Wafers
Yes[2]
Accurate?

Configuration & options3

Dicing[8]
Accurate?
Dicing
Yes[2]
Accurate?
Automation
Automatic[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
DFL 7160 Laser Dicing———waferpedia.com[1]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

How many cassette ports does it have?

The Disco DFL 7160 Automatic has one cassette port.[8][2]

Does the DFL 7160 Automatic support Taiko wafer cutting?

Yes, the machine is capable of circular ring cutting of Taiko wafers.[8][2]

What is the machine category?

The Disco DFL 7160 Automatic is categorized under Dicing & Grinding.[1][2][9][10][11]

Not publicly documented

The following facts about the DFL 7160 Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7160 Automatic are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the DFL 7160 Automatic are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DFL 7160 Automatic are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DFL 7160 Automatic is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the DFL 7160 Automatic are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (11)Every fact above is drawn from these public sources
  1. [1]waferpedia.com — waferpedia.comwaferpedia.com
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]Inventory photo
  6. [6]Inventory photo
  7. [7]Inventory photo
  8. [8]inventory listing
  9. [9]Disco DFL 7160 Automatic vs Disco DGP 8761 + DFM 2800 In-Line comparison | Waferpedia — waferpedia.comwaferpedia.com
  10. [10]Disco DFL 7160 Automatic vs Disco DGP 8760 + DFM 2800 comparison | Waferpedia — waferpedia.comwaferpedia.com
  11. [11]Disco DFL 7160 Automatic vs Disco Dicing comparison | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 9, 2026.

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